Search International and National Patent Collections

1. (WO2017156370) TECHNIQUE FOR INCREASING THROUGHPUT FOR CHANNEL BONDING

Pub. No.:    WO/2017/156370    International Application No.:    PCT/US2017/021741
Publication Date: Fri Sep 15 01:59:59 CEST 2017 International Filing Date: Sat Mar 11 00:59:59 CET 2017
IPC: H04B 7/08
H04L 25/06
H04W 74/00
Applicants: QUALCOMM INCORPORATED
Inventors: SANDEROVICH, Amichai
AHARON, Mordechay
EITAN, Alecsander Petru
Title: TECHNIQUE FOR INCREASING THROUGHPUT FOR CHANNEL BONDING
Abstract:
Certain aspects of the present disclosure provide methods and apparatus for performing communications using a bonded channel across multiple channels.