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1. (WO2017156195) APPARATUS AND METHODS TO REMOVE UNBONDED AREAS WITHIN BONDED SUBSTRATES USING LOCALIZED ELECTROMAGNETIC WAVE ANNEALING

Pub. No.:    WO/2017/156195    International Application No.:    PCT/US2017/021458
Publication Date: Fri Sep 15 01:59:59 CEST 2017 International Filing Date: Thu Mar 09 00:59:59 CET 2017
IPC: H01J 61/24
H01J 1/02
Applicants: OSTENDO TECHNOLOGIES, INC.
Inventors: EL-GHOROURY, Hussein
LIU, Minghsuan
YADAVALLI, Kameshwar
TANG, Weilong
HASKELL, Benjamin
ZHOU, Hailong
Title: APPARATUS AND METHODS TO REMOVE UNBONDED AREAS WITHIN BONDED SUBSTRATES USING LOCALIZED ELECTROMAGNETIC WAVE ANNEALING
Abstract:
An electromagnetic wave irradiation apparatus and methods to bond unbonded areas in a bonded pair of substrates are disclosed. The unbonded areas between the substrates are eliminated by thermal activation in the unbonded areas induced by electromagnetic wave irradiation having a wavelength selected to effect a phonon or electron excitation. A first substrate of the bonded pair of substrates absorbs the electromagnetic radiation and a portion of a resulting thermal energy transfers to an interface of the bonded pair of substrates at the unbonded areas with sufficient flux to cause opposite sides the first and second substrates to interact and dehydrate to form a bond (e.g., Si-O-Si bond).