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1. (WO2017156006) FLOOR AND CEILING PANEL FOR SLAB-FREE FLOOR SYSTEM OF A BUILDING

Pub. No.:    WO/2017/156006    International Application No.:    PCT/US2017/021168
Publication Date: Fri Sep 15 01:59:59 CEST 2017 International Filing Date: Wed Mar 08 00:59:59 CET 2017
IPC: F24D 3/14
E04B 5/48
E04C 2/52
Applicants: INNOVATIVE BUILDING TECHNOLOGIES, LLC
Inventors: COLLINS, Arlan
WOERMAN, Mark
Title: FLOOR AND CEILING PANEL FOR SLAB-FREE FLOOR SYSTEM OF A BUILDING
Abstract:
Floor and ceiling panels and methods of constructing a floor system for a building are described. In some embodiments, a panel includes a plurality of joists, a corrugated form deck disposed above and attached to the plurality of joists, a ceiling substrate disposed below and attached to the plurality of joists, and an in-floor radiant heat member disposed between the corrugated form deck and the ceiling substrate. In some embodiments, the panel includes a plurality of joists, a corrugated form deck disposed above and attached to the plurality of joists, and a sound dampener disposed between the corrugated form deck and the plurality of joists. In some embodiments, the method includes attaching a pre-assembled panel to a frame of the building and pouring concrete onto the panel so that a radiant heat member is separated from the concrete by a corrugated form deck of the panel.