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1. (WO2017155947) APPARATUS AND METHOD OF MIDPLANE PANEL CONNECTIONS
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Pub. No.: WO/2017/155947 International Application No.: PCT/US2017/021091
Publication Date: 14.09.2017 International Filing Date: 07.03.2017
IPC:
H05K 1/18 (2006.01) ,H05K 3/36 (2006.01) ,H05K 5/00 (2006.01) ,H05K 7/20 (2006.01)
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1
Printed circuits
18
Printed circuits structurally associated with non-printed electric components
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
36
Assembling printed circuits with other printed circuits
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
5
Casings, cabinets or drawers for electric apparatus
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
7
Constructional details common to different types of electric apparatus
20
Modifications to facilitate cooling, ventilating, or heating
Applicants:
SYMBOLIC IO CORPORATION [US/US]; 101 Crawfords Corner Road Holmdel, NJ 07733, US
Inventors:
IGNOMIRELLO, Brian, M.; US
Agent:
ALTMAN, Daniel, E.; US
Priority Data:
15/089,05301.04.2016US
62/305,68609.03.2016US
Title (EN) APPARATUS AND METHOD OF MIDPLANE PANEL CONNECTIONS
(FR) APPAREIL ET PROCÉDÉ DE CONNEXIONS DE PANNEAU DE FOND DE PANIER CENTRAL
Abstract:
(EN) A connector board for an electronic assembly, the connector board including a passive circuit board, mounted horizontally at an elevated position within the electronic assembly, a voltage distribution plane formed as a layer of the passive circuit board, a first electrical interface coupled to the voltage distribution plane, the first electrical interface used to supply a predetermined voltage to the voltage distribution plane, and a second electrical interface coupled to the voltage distribution plane, the second electrical interface used to draw the predetermined voltage from the voltage distribution plane.
(FR) L'invention concerne une carte de connexion pour un ensemble électronique, la carte de connexion contenant une carte de circuit imprimé passive, montée horizontalement à une position élevée dans l'ensemble électronique, un plan de distribution de tension sous la forme d'une couche de la carte de circuit imprimé passive, une première interface électrique accouplée au plan de distribution de tension, la première interface électrique étant utilisée pour fournir une tension prédéterminée au plan de distribution de tension, et une deuxième interface électrique accouplée au plan de distribution de tension, la deuxième interface électrique étant utilisée pour soutirer la tension prédéterminée au plan de distribution de tension.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)