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1. (WO2017155860) HEADPHONE JOINT

Pub. No.:    WO/2017/155860    International Application No.:    PCT/US2017/020891
Publication Date: Fri Sep 15 01:59:59 CEST 2017 International Filing Date: Tue Mar 07 00:59:59 CET 2017
IPC: H04R 1/10
H04R 5/033
Applicants: BOSE CORPORATION
Inventors: BREEN, John, J.
WALLACE, Eric, M.
MONAHAN, Michael, J.
Title: HEADPHONE JOINT
Abstract:
A headphone with a headband and at least one earcup. The at least one earcup is rnovably coupled to the headband by a joint that is structured to allow rotation of the earcup relative to the headband about two mutually perpendicular axes, and translation along one of these axes.