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1. (WO2017155671) ALUMINUM ELECTROPLATING AND OXIDE FORMATION AS BARRIER LAYER FOR ALUMINUM SEMICONDUCTOR PROCESS EQUIPMENT

Pub. No.:    WO/2017/155671    International Application No.:    PCT/US2017/017817
Publication Date: Fri Sep 15 01:59:59 CEST 2017 International Filing Date: Wed Feb 15 00:59:59 CET 2017
IPC: H01L 21/28
H01L 21/02
Applicants: APPLIED MATERIALS, INC.
Inventors: PAREEK, Yogita
KALITA, Laksheswar
BAJAJ, Geetika
PAPKE, Kevin A.
KADAM, Ankur
THAKUR, Bipin
LIN, Yixing
LUBOMIRSKY, Dmitry
GORADIA, Prerna A.
Title: ALUMINUM ELECTROPLATING AND OXIDE FORMATION AS BARRIER LAYER FOR ALUMINUM SEMICONDUCTOR PROCESS EQUIPMENT
Abstract:
The present disclosure generally relates to methods of electro-chemically forming aluminum or aluminum oxide. The methods may include the optional preparation of a an electrochemical bath, the electrodepositon of aluminum or aluminum oxide onto a substrate, removal of solvent form the surface of the substrate, and post treatment of the substrate having the electrodeposited aluminum or aluminum oxide thereon.