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1. (WO2017155117) ADHESIVE FOR SEMICONDUCTOR SENSOR CHIP MOUNTING, AND SEMICONDUCTOR SENSOR

Pub. No.:    WO/2017/155117    International Application No.:    PCT/JP2017/009816
Publication Date: Fri Sep 15 01:59:59 CEST 2017 International Filing Date: Sat Mar 11 00:59:59 CET 2017
IPC: G01L 9/00
C09J 11/00
C09J 11/08
C09J 183/04
H01L 29/84
Applicants: SEKISUI CHEMICAL CO., LTD.
積水化学工業株式会社
Inventors: UEDA, Saori
上田 沙織
YAMADA, Yasuyuki
山田 恭幸
Title: ADHESIVE FOR SEMICONDUCTOR SENSOR CHIP MOUNTING, AND SEMICONDUCTOR SENSOR
Abstract:
This adhesive for semiconductor sensor chip mounting can reduce noise sensing and can improve heat resistance and thermal cycle resistance characteristics. This adhesive for semiconductor sensor chip mounting is used in semiconductor sensor chip mounting, and contains a silicone resin and a spacer. The 10% compressive elasticity modulus of the spacer is 10-2000 N/mm2, the compression recovery rate of the spacer is less than or equal to 20%, and the average particle diameter is 10-200 μm.