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1. (WO2017155116) ADHESIVE FOR SEMICONDUCTOR MOUNTING, AND SEMICONDUCTOR SENSOR
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Pub. No.: WO/2017/155116 International Application No.: PCT/JP2017/009815
Publication Date: 14.09.2017 International Filing Date: 10.03.2017
IPC:
G01L 9/00 (2006.01) ,C09J 11/00 (2006.01) ,C09J 11/08 (2006.01) ,C09J 183/04 (2006.01) ,H01L 29/84 (2006.01)
G PHYSICS
01
MEASURING; TESTING
L
MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
9
Measuring steady or quasi-steady pressure of a fluid or a fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
J
ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
11
Features of adhesives not provided for in group C09J9/76
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
J
ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
11
Features of adhesives not provided for in group C09J9/76
08
Macromolecular additives
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
J
ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
183
Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
04
Polysiloxanes
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
29
Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having at least one potential-jump barrier or surface barrier; Capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof
66
Types of semiconductor device
84
controllable by variation of applied mechanical force, e.g. of pressure
Applicants:
積水化学工業株式会社 SEKISUI CHEMICAL CO., LTD. [JP/JP]; 大阪府大阪市北区西天満2丁目4番4号 4-4, Nishitemma 2-chome, Kita-ku, Osaka-shi, Osaka 5308565, JP
Inventors:
上田 沙織 UEDA, Saori; JP
山田 恭幸 YAMADA, Yasuyuki; JP
Agent:
特許業務法人 宮▲崎▼・目次特許事務所 MIYAZAKI & METSUGI; 大阪府大阪市中央区常盤町1丁目3番8号 中央大通FNビル Chuo Odori FN Bldg., 3-8, Tokiwamachi 1-chome, Chuo-ku, Osaka-shi, Osaka 5400028, JP
Priority Data:
2016-04717310.03.2016JP
2016-04717410.03.2016JP
Title (EN) ADHESIVE FOR SEMICONDUCTOR MOUNTING, AND SEMICONDUCTOR SENSOR
(FR) ADHÉSIF POUR MONTAGE DE SEMI-CONDUCTEURS, ET CAPTEUR À SEMI-CONDUCTEURS
(JA) 半導体実装用接着剤及び半導体センサ
Abstract:
(EN) An adhesive for semiconductor mounting is provided which can achieve high-precision gap control and can improve heat resistance when mounting a semiconductor. This adhesive for semiconductor mounting is used in semiconductor mounting, and contains a silicone resin and a spacer. The content of the spacer is 0.1-5 wt% of 100 wt% of the adhesive, the 10% compressive elasticity modulus of the spacer is 5000-15,000 N/mm2, and the average particle diameter of the spacer is 10-200 μm.
(FR) L'invention concerne un adhésif pour montage de semi-conducteurs, qui permet d'obtenir une commande d'intervalle de haute précision et qui permet d'améliorer la résistance thermique lors du montage d'un semi-conducteur. Ledit adhésif pour montage de semi-conducteurs est utilisé dans le montage de semi-conducteurs, et contient une résine de silicone et un espaceur. L'espaceur représente entre 0,1 et 5 % en poids pour 100 % en poids de l'adhésif, le module d'élasticité en compression à 10 % de l'espaceur est compris entre 5000 et 15000 N/mm2, et le diamètre de particule moyen de l'espaceur est compris entre 10 et 200 µm.
(JA) 半導体を実装する場合に、ギャップを高精度に制御でき、かつ、耐熱性を高めることができる半導体実装用接着剤を提供する。 本発明に係る半導体実装用接着剤は、半導体の実装に用いられる接着剤であって、シリコーン樹脂と、スペーサとを含み、前記スペーサの含有量が、前記接着剤100重量%中、0.1重量%以上、5重量%以下であり、前記スペーサの10%圧縮弾性率が、5000N/mm以上、15000N/mm以下であり、前記スペーサの平均粒子径が、10μm以上、200μm以下である。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)