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1. (WO2017155094) ELECTRONIC-COMPONENT MOUNTING DEVICE AND METHOD FOR MOUNTING ELECTRONIC COMPONENT

Pub. No.:    WO/2017/155094    International Application No.:    PCT/JP2017/009722
Publication Date: Fri Sep 15 01:59:59 CEST 2017 International Filing Date: Sat Mar 11 00:59:59 CET 2017
IPC: H05K 13/04
H05K 13/08
Applicants: KAWASAKI JUKOGYO KABUSHIKI KAISHA
川崎重工業株式会社
Inventors: HIRATA, Kazunori
平田 和範
IWASAKI, Yukio
岩▲崎▼ 友希男
Title: ELECTRONIC-COMPONENT MOUNTING DEVICE AND METHOD FOR MOUNTING ELECTRONIC COMPONENT
Abstract:
An electronic-component mounting device (10) is provided with: a gripping part (29) for gripping an electronic component (30) having a lead wire (31); a conveyance part for conveying the electronic component (30) gripped by the gripping part (29) onto a substrate (40) to which a insertion hole (41) is provided; and a swinging part for swinging the electronic component (30) and the substrate (40) relative to each other, the electronic component (30) being released on the substrate (40) from gripping by the gripping part.