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1. (WO2017155002) SUBSTRATE BONDING METHOD

Pub. No.:    WO/2017/155002    International Application No.:    PCT/JP2017/009335
Publication Date: Fri Sep 15 01:59:59 CEST 2017 International Filing Date: Thu Mar 09 00:59:59 CET 2017
IPC: H01L 21/02
Applicants: BONDTECH CO., LTD.
ボンドテック株式会社
Inventors: YAMAUCHI Akira
山内 朗
Title: SUBSTRATE BONDING METHOD
Abstract:
A substrate bonding method comprises: a hydrophilization process step of performing a hydrophilization process for causing water or an OH-containing substance to become attached to a bonding face surface of each of substrates (301, 302); a substrate warping step of warping the substrate (301); an abutting step of abutting the bonding face of the substrate (301) and the bonding face of the substrate (302) against each other at center portions thereof; and a laminating step of reducing the distance between an outer peripheral portion of the substrate (301) and an outer peripheral portion of the substrate (302) with the center portions thereof abutted against each other so as to maintain a constant distance, and reducing the distance until the bonding face of the substrate (301) and the bonding face of the substrate (302) are positioned for lamination across the entire faces thereof. Before or after the abutting step, the distance between the substrates (301, 302) is measured and the distance between the outer peripheral portions of the substrates (301, 302) is reduced.