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1. (WO2017154956) LOW-MELTING-POINT COMPOSITION, SEALANT, AND SEALING METHOD

Pub. No.:    WO/2017/154956    International Application No.:    PCT/JP2017/009168
Publication Date: Fri Sep 15 01:59:59 CEST 2017 International Filing Date: Thu Mar 09 00:59:59 CET 2017
IPC: C03C 8/02
C03C 8/16
Applicants: NIHON YAMAMURA GLASS CO., LTD.
日本山村硝子株式会社
Inventors: IKEDA, Takuro
池田 拓朗
Title: LOW-MELTING-POINT COMPOSITION, SEALANT, AND SEALING METHOD
Abstract:
Disclosed is a low-melting-point composition with which it is possible to seal an object to be sealed by applying the composition to the object to be sealed, and then cooling and solidifying after heat-treating in a temperature range of 250°C or lower in air. This composition is a low-melting-point composition comprising Ag, Ge, I, and O as essential constituent elements, wherein when represented as an aggregate of various compounds shown by the formula MQm/q (in the formula, M is a cation of valence m and Q is an anion of valence q) obtained by bonding a cation and anion with all anions other than oxide ions (O2-) bonded with Ag ions, the proportions of these compounds satisfy the following conditions. AgI: 10-60 mol%, AgO1/2: 25-60 mol%, GeO2: 10-30 mol%, ΣAgQ1/q: 70-85 mol%, ΣMOm/2: 40-90 mol%, and (ΣMOm/2-AgO1/2)/AgO1/2: 0.37-0.60 (mol/mol).