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1. (WO2017154954) CIRCUIT STRUCTURE
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Pub. No.: WO/2017/154954 International Application No.: PCT/JP2017/009159
Publication Date: 14.09.2017 International Filing Date: 08.03.2017
IPC:
H01F 27/06 (2006.01) ,H01F 27/02 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
F
MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
27
Details of transformers or inductances, in general
06
Mounting, supporting, or suspending transformers, reactors, or choke coils
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
F
MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
27
Details of transformers or inductances, in general
02
Casings
Applicants:
株式会社オートネットワーク技術研究所 AUTONETWORKS TECHNOLOGIES, LTD. [JP/JP]; 三重県四日市市西末広町1番14号 1-14, Nishisuehiro-cho, Yokkaichi-shi, Mie 5108503, JP
住友電装株式会社 SUMITOMO WIRING SYSTEMS, LTD. [JP/JP]; 三重県四日市市西末広町1番14号 1-14, Nishisuehiro-cho, Yokkaichi-shi, Mie 5108503, JP
住友電気工業株式会社 SUMITOMO ELECTRIC INDUSTRIES, LTD. [JP/JP]; 大阪府大阪市中央区北浜4丁目5番33号 5-33, Kitahama 4-chome, Chuo-ku, Osaka-shi, Osaka 5410041, JP
Inventors:
土田 敏之 TSUCHIDA Toshiyuki; JP
山根 茂樹 YAMANE Shigeki; JP
前田 広利 MAEDA Hirotoshi; JP
大田 拓也 OTA Takuya; JP
愛知 純也 AICHI Junya; JP
Agent:
特許業務法人暁合同特許事務所 AKATSUKI UNION PATENT FIRM; 愛知県名古屋市中区栄二丁目1番1号 日土地名古屋ビル5階 5th Floor, Nittochi Nagoya Bldg., 1-1, Sakae 2-chome, Naka-ku, Nagoya-shi, Aichi 4600008, JP
Priority Data:
2016-04528309.03.2016JP
Title (EN) CIRCUIT STRUCTURE
(FR) STRUCTURE DE CIRCUIT
(JA) 回路構成体
Abstract:
(EN) A circuit structure 10 comprises a coil device 12 including a ferrite core 14, and a heat sink 11 to which the coil device 12 is secured, wherein: the circuit structure includes a bottom wall 29 attached to the ferrite core 14, the bottom wall 29 being made of a first material having a thermal expansion coefficient greater than the thermal expansion coefficient of the ferrite core 14, and the bottom wall 29 being made of a second material having a thermal expansion coefficient greater than that of the ferrite core 14 and less than that of the heat sink 11; and the circuit structure includes an adhesive layer 35 disposed between the bottom wall 29 and the heat sink 11 and adhering the bottom wall 29 and the heat sink 11 together.
(FR) L’invention concerne une structure de circuit (10) qui comprend un dispositif de bobine (12) comprenant un noyau de ferrite (14), et un puits thermique (11) auquel le dispositif de bobine (12) est fixé, la structure de circuit comprenant une paroi inférieure (29) fixée au noyau de ferrite (14), la paroi inférieure (29) étant constituée d’un premier matériau ayant un coefficient d’expansion thermique supérieur au coefficient d’expansion thermique du noyau de ferrite (14), et la paroi intérieure (29) étant constituée d’un second matériau ayant un coefficient d’expansion thermique supérieur à celui du noyau de ferrite (14) et inférieur à celui du puits thermique (11) ; et la structure de circuit comprenant une couche adhésive (35) disposée entre la paroi inférieure (29) et le puits thermique (11) et collant la paroi inférieure (29) et le puits thermique (11) l'un à l'autre.
(JA) フェライトコア14を備えたコイル装置12と、コイル装置12が固定されるヒートシンク11と、を有する回路構成体10であって、フェライトコア14に取り付けられる底壁29を有し、底壁29は、フェライトコア14の熱膨張率よりも大きな熱膨張率を有する第1材料からなり、底壁29は、フェライトコア14の熱膨張率よりも大きく、且つ、ヒートシンク11の熱膨張率よりも小さな熱膨張率を有する第2材料からなり、底壁29とヒートシンク11との間に配されて、底壁29とヒートシンク11とを接着する接着剤層35を備える。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)