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1. (WO2017154893) ELECTRODE CONNECTION STRUCTURE, LEAD FRAME AND METHOD FOR FORMING ELECTRODE CONNECTION STRUCTURE

Pub. No.:    WO/2017/154893    International Application No.:    PCT/JP2017/008970
Publication Date: Fri Sep 15 01:59:59 CEST 2017 International Filing Date: Wed Mar 08 00:59:59 CET 2017
IPC: H01L 21/60
H01L 23/50
Applicants: WASEDA UNIVERSITY
学校法人早稲田大学
MITSUI HIGH-TEC, INC.
株式会社三井ハイテック
Inventors: TATSUMI, Kohei
巽 宏平
UEDA, Kazutoshi
上田 和敏
SATO, Nobuaki
佐藤 信明
SHIMIZU, Koji
清水 孝司
Title: ELECTRODE CONNECTION STRUCTURE, LEAD FRAME AND METHOD FOR FORMING ELECTRODE CONNECTION STRUCTURE
Abstract:
[Problem] To provide: an electrode connection structure which connects, by plating with high quality, electrode and lateral surfaces of a plurality of long leads in the longitudinal direction, said plurality of long leads being arranged in parallel; and the like. [Solution] An electrode connection structure which connects, by plating, an electrode of a semiconductor chip 12 and/or a substrate electrode with a plurality of long leads 11 of a lead frame 10, and wherein: the plurality of long leads 11 of the lead frame 10 are arranged in parallel; a lateral surface of each lead 11 in the longitudinal direction is connected to the electrode of the semiconductor chip 12 and/or the substrate electrode by plating; and at the connection part of a first connection surface 13 of the electrode of the semiconductor chip 12 and/or the substrate electrode, said first connection surface 13 being connected to each lead 11, and a second connection surface 14 in the lateral surface of each lead 11 in the longitudinal direction, said second connection surface 14 being connected to the first connection surface 13, the distance between the first connection surface 13 and the second connection surface 14 is continuously increased from an edge part 15 of the second connection surface 14, which is in contact with the first connection surface 13, toward an outer part 16 of the second connection surface 14.