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1. (WO2017154786) FILM HAVING PLATED-LAYER PRECURSOR LAYER, FILM HAVING PATTERNED PLATED LAYER, ELECTROCONDUCTIVE FILM, AND TOUCH PANEL
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Pub. No.: WO/2017/154786 International Application No.: PCT/JP2017/008551
Publication Date: 14.09.2017 International Filing Date: 03.03.2017
IPC:
B32B 7/02 (2006.01) ,B32B 15/08 (2006.01) ,C23C 18/18 (2006.01) ,C23C 18/31 (2006.01) ,H05K 3/18 (2006.01)
B PERFORMING OPERATIONS; TRANSPORTING
32
LAYERED PRODUCTS
B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
7
Layered products characterised by the relation between layers, i.e. products essentially comprising layers having different physical properties or products characterised by the interconnection of layers
02
in respect of physical properties, e.g. hardness
B PERFORMING OPERATIONS; TRANSPORTING
32
LAYERED PRODUCTS
B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
15
Layered products essentially comprising metal
04
comprising metal as the main or only constituent of a layer, next to another layer of a specific substance
08
of synthetic resin
C CHEMISTRY; METALLURGY
23
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
C
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
18
Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
16
by reduction or substitution, i.e. electroless plating
18
Pretreatment of the material to be coated
C CHEMISTRY; METALLURGY
23
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
C
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
18
Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
16
by reduction or substitution, i.e. electroless plating
31
Coating with metals
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
10
in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
18
using precipitation techniques to apply the conductive material
Applicants:
富士フイルム株式会社 FUJIFILM CORPORATION [JP/JP]; 東京都港区西麻布2丁目26番30号 26-30, Nishiazabu 2-chome, Minato-ku, Tokyo 1068620, JP
Inventors:
一木 孝彦 ICHIKI Takahiko; JP
塚本 直樹 TSUKAMOTO Naoki; JP
千賀 武志 SENGA Takeshi; JP
笠原 健裕 KASAHARA Takehiro; JP
寺尾 祐子 TERAO Yuko; JP
金山 修二 KANAYAMA Shuuji; JP
Agent:
渡辺 望稔 WATANABE Mochitoshi; JP
三和 晴子 MIWA Haruko; JP
伊東 秀明 ITOH Hideaki; JP
三橋 史生 MITSUHASHI Fumio; JP
Priority Data:
2016-04874111.03.2016JP
Title (EN) FILM HAVING PLATED-LAYER PRECURSOR LAYER, FILM HAVING PATTERNED PLATED LAYER, ELECTROCONDUCTIVE FILM, AND TOUCH PANEL
(FR) FILM POURVU D'UNE COUCHE DE PRÉCURSEUR PLAQUÉE, FILM POURVU D'UNE COUCHE PLAQUÉE À MOTIFS, FILM ÉLECTROCONDUCTEUR, ET PANNEAU TACTILE
(JA) 被めっき層前駆体層付きフィルム、パターン状被めっき層付きフィルム、導電性フィルム、タッチパネル
Abstract:
(EN) The present invention addresses the problem of providing a film having a plated-layer precursor layer in which it is possible to form a metal layer that has exceptional roll-to-roll production properties and exceptional adhesiveness with respect to a substrate. The present invention also addresses the problem of providing a film having a patterned plated layer, as well as an electroconductive film and a touch panel in which the film having a patterned plated layer is used. This film having a plated-layer precursor layer has a substrate, and an undercoat layer and a plated-layer precursor layer disposed on the substrate in the stated order from the substrate side, wherein the hardness of the surface of the undercoat layer is 10 N/mm2 or less, and the coefficient of friction of the undercoat layer with respect to a release paper is 5 or less.
(FR) La présente invention vise à fournir un film pourvu d'une couche de précurseur de couche plaquée où il est possible de former une couche métallique qui a des propriétés exceptionnelles de production de rouleau à rouleau et une adhérence exceptionnelle vis-à-vis d'un substrat. La présente invention vise également à fournir un film ayant une couche plaquée à motifs, ainsi qu'un film électroconducteur et un panneau tactile où le film pourvu d'une couche plaquée à motifs est utilisé. A cet effet, l'invention porte sur un film pourvu d'une couche de précurseur de couche plaquée, lequel film comprend un substrat, et une couche de revêtement inférieur et une couche de précurseur de couche plaquée disposée sur le substrat, dans l'ordre indiqué à partir du côté de substrat, la dureté de la surface de revêtement inférieure étant inférieure ou égale à 10 N/mm2, et le coefficient de frottement de la couche de revêtement inférieur par rapport à un papier anti-adhérent étant inférieur ou égal à 5.
(JA) 本発明の課題は、ロールtoロールでの製造性に優れ、且つ、基板との密着性に優れた金属層を形成することができる被めっき層前駆体層付きフィルムを提供することである。また、本発明の他の課題は、パターン状被めっき層付きフィルム、並びに、それを用いた導電性フィルム及びタッチパネルを提供することである。 本発明の被めっき層前駆体層付きフィルムは、基板と、上記基板上に基板側から順に配置されたアンダーコート層と被めっき層前駆体層と、を有する被めっき層前駆体層付きフィルムであって、 上記アンダーコート層は、その表面における硬度が10N/mm以下であり、且つ、離形紙との摩擦係数が5以下である。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)