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1. (WO2017154737) INSERT-MOLDED ARTICLE, ELECTRICAL SIGNAL CONNECTOR, ENDOSCOPE, AND INSERT MOLDING METHOD
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Pub. No.: WO/2017/154737 International Application No.: PCT/JP2017/008323
Publication Date: 14.09.2017 International Filing Date: 02.03.2017
IPC:
B29C 45/14 (2006.01) ,A61B 1/00 (2006.01) ,B32B 15/08 (2006.01) ,H01R 13/405 (2006.01)
B PERFORMING OPERATIONS; TRANSPORTING
29
WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
C
SHAPING OR JOINING OF PLASTICS; SHAPING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL; AFTER- TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
45
Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
14
incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
A HUMAN NECESSITIES
61
MEDICAL OR VETERINARY SCIENCE; HYGIENE
B
DIAGNOSIS; SURGERY; IDENTIFICATION
1
Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor
B PERFORMING OPERATIONS; TRANSPORTING
32
LAYERED PRODUCTS
B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
15
Layered products essentially comprising metal
04
comprising metal as the main or only constituent of a layer, next to another layer of a specific substance
08
of synthetic resin
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
R
ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
13
Details of coupling devices of the kinds covered by groups H01R12/7087
40
Securing contact members in or to a base or case; Insulating of contact members
405
Securing in non-demountable manner, e.g. moulding, riveting
Applicants:
オリンパス株式会社 OLYMPUS CORPORATION [JP/JP]; 東京都八王子市石川町2951番地 2951, Ishikawa-machi, Hachioji-shi, Tokyo 1928507, JP
Inventors:
遠藤 哲也 ENDO Tetsuya; JP
志賀 直仁 SHIGA Naohito; JP
白水 航平 SHIRAMIZU Kohei; JP
中本 順子 NAKAMOTO Junko; JP
Agent:
棚井 澄雄 TANAI Sumio; JP
志賀 正武 SHIGA Masatake; JP
鈴木 三義 SUZUKI Mitsuyoshi; JP
高柴 忠夫 TAKASHIBA Tadao; JP
鈴木 史朗 SUZUKI Shirou; JP
橋本 宏之 HASHIMOTO Hiroyuki; JP
Priority Data:
2016-04482708.03.2016JP
Title (EN) INSERT-MOLDED ARTICLE, ELECTRICAL SIGNAL CONNECTOR, ENDOSCOPE, AND INSERT MOLDING METHOD
(FR) ARTICLE MOULÉ PAR INSERTION, CONNECTEUR DE SIGNAL ÉLECTRIQUE, ENDOSCOPE ET PROCÉDÉ DE MOULAGE PAR INSERTION
(JA) インサート成形品、電気信号コネクタ、内視鏡及びインサート成形法
Abstract:
(EN) In this insert-molded article, a metal substrate and a resin are joined, the insert-molded article has, between the metal substrate and the resin and in order from the metal substrate side, a base layer, a noble-metal layer, a compound layer comprising a compound including Si and O, and a mixed layer in which the compound and the resin are intermingled, and Ni is present in the compound layer and the mixed layer.
(FR) Dans l'article moulé par insertion selon l'invention, un substrat métallique et une résine sont assemblés, l'article moulé par insertion présente, entre le substrat métallique et la résine et dans l'ordre depuis le côté du substrat métallique, une couche de base, une couche de métal noble, une couche de composé comprenant un composé comprenant Si et O et une couche mixte dans laquelle le composé et la résine sont entremêlés et du Ni est présent dans la couche de composé et la couche mixte.
(JA) 本インサート成形品は、金属基材と樹脂とが接合されたインサート成形品であり、前記金属基材と前記樹脂との間に、前記金属基材側から順に、下地層と、貴金属層と、Si及びOを含む化合物からなる化合物層と、前記化合物及び前記樹脂が混在する混合層と、を有し、前記化合物層及び前記混合層において、Niが存在する。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)