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1. (WO2017154699) SEALING SURFACE PROCESSING MACHINE AND METHOD

Pub. No.:    WO/2017/154699    International Application No.:    PCT/JP2017/008131
Publication Date: Fri Sep 15 01:59:59 CEST 2017 International Filing Date: Thu Mar 02 00:59:59 CET 2017
IPC: B23P 6/00
B23B 1/00
B23B 3/26
B23B 5/06
B23B 25/00
B23Q 11/00
Applicants: MITSUBISHI HITACHI POWER SYSTEMS, LTD.
三菱日立パワーシステムズ株式会社
Inventors: SUGITANI, Daichi
杉谷 大地
TERADA, Genta
寺田 源太
TANIGUCHI, Shigenori
谷口 重徳
SUEZAWA, Nobuchika
末澤 伸周
SASAKI, Daisuke
佐々木 大輔
KANEMITSU, Kiyoshi
兼光 清史
IWASAWA, Tatsuya
岩澤 竜弥
NAKAO, Tetsuhide
中尾 鉄英
OYAMA, Koji
大山 幸司
SAKAMOTO, Naoki
坂本 脩貴
WAKAMATSU, Yu
若松 優
OHARA, Takayoshi
小原 崇福
KAMADA, Masaru
鎌田 優
Title: SEALING SURFACE PROCESSING MACHINE AND METHOD
Abstract:
In this sealing surface processing machine and method, provided are: a pedestal (10) which is attached to a valve main body (110); a main body (20) which is movably supported on the pedestal (10); a tool holder (60) for holding a cutting tool (T) for processing an attachment surface (114); a main shaft (40) which rotates the tool holder (60) relative to the main body (20), around an axis parallel to the movement direction of a valve element (124); a first moving part (30) which is capable of moving the tool holder (60) relative to the main body (20), along the Z-axis direction along which the valve element (124) moves; a second moving part (50) which is capable of moving the tool holder (60) relative to the main body (20), along the X-axis direction and the Y-axis direction which intersect the movement direction of the valve element (124); a first adjustment device (70) which adjusts the position of the main body (20) in the Z-axis direction relative to the pedestal (10); and a second adjustment device (80) which adjusts the position of the main body (20) in the X-axis direction and the Y-axis direction relative to the pedestal (10).