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1. (WO2017154643) ELECTRONIC CIRCUIT BOARD AND ULTRASONIC BONDING METHOD
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Pub. No.: WO/2017/154643 International Application No.: PCT/JP2017/007532
Publication Date: 14.09.2017 International Filing Date: 27.02.2017
IPC:
H05K 1/02 (2006.01) ,B23K 20/10 (2006.01) ,H05K 3/32 (2006.01)
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1
Printed circuits
02
Details
B PERFORMING OPERATIONS; TRANSPORTING
23
MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
K
SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
20
Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
10
making use of vibrations, e.g. ultrasonic welding
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
30
Assembling printed circuits with electric components, e.g. with resistor
32
electrically connecting electric components or wires to printed circuits
Applicants:
本田技研工業株式会社 HONDA MOTOR CO., LTD. [JP/JP]; 東京都港区南青山二丁目1番1号 1-1, Minami-Aoyama 2-chome, Minato-ku, Tokyo 1078556, JP
Inventors:
笛木 信宏 FUEKI, Nobuhiro; JP
国頭 正樹 KUNIGAMI, Masaki; JP
増田 次男 MASUDA, Tsugio; JP
Agent:
特許業務法人創成国際特許事務所 SATO & ASSOCIATES; 東京都新宿区西新宿6-24-1 西新宿三井ビルディング 18階 Nishi-Shinjuku Mitsui Building 18F, 24-1, Nishi-Shinjuku 6-chome, Shinjuku-ku, Tokyo 1600023, JP
Priority Data:
2016-04792211.03.2016JP
Title (EN) ELECTRONIC CIRCUIT BOARD AND ULTRASONIC BONDING METHOD
(FR) CARTE DE CIRCUITS IMPRIMÉS ÉLECTRONIQUE ET PROCÉDÉ DE SOUDAGE PAR ULTRASONS
(JA) 電子回路基板および超音波接合方法
Abstract:
(EN) Provided are: an electronic circuit board which is provided with a substrate containing a synthetic resin and one conductor bonded to the upper surface of the substrate, said electronic circuit board being capable of improving the bonding quality of another conductor to the one conductor; and a ultrasonic bonding method. A PCB 1 comprises a reinforcing member 12 that is constituted of a material having a higher melting point than the synthetic resin that constitutes a substrate 10. A first reinforcing member 121, which constitutes the reinforcing member 12, is constituted of a substantially planer or belt-like metal embedded in the substrate 10 so as to at least partly overlap upper surface wiring 11. A second reinforcing member 122, which constitutes the reinforcing member 12, is constituted of a substantially columnar metal that extends vertically, is connected to the bottom surface of the upper surface wiring 11, and is physically, chemically, or mechanically linked to the first reinforcing member 121 in the same manner as a via 111.
(FR) L’invention concerne une carte de circuits imprimés électronique qui est pourvue d'un substrat contenant une résine synthétique et d'un conducteur soudé sur la surface supérieure du substrat, ladite carte de circuits imprimés électronique étant capable d’améliorer la qualité de soudage d’un autre conducteur sur le premier conducteur ; un procédé de soudage par ultrasons. Une carte de circuits imprimés (PCB) 1 comprend un élément de renforcement 12 qui est constitué d’un matériau ayant un point de fusion supérieur à celui de la résine synthétique qui constitue le substrat 10. Un premier élément de renforcement 121, qui constitue l’élément de renforcement 12, est constitué d’un métal de type courroie ou sensiblement plus plat incorporé dans le substrat 10 de façon à chevaucher au moins partiellement un câblage de surface supérieure 11. Un second élément de renforcement 122, qui constitue l’élément de renforcement 12, est constitué d’un métal sensiblement en colonne qui s’étend verticalement, qui est relié à la surface inférieure du câblage de surface supérieure 11 et qui est relié physiquement, chimiquement ou mécaniquement au premier élément de renforcement 121 de la même manière qu’un trou d'interconnexion 111.
(JA) 合成樹脂を含む基板の上面に接合されている一方の導体に対する他方の導体の接合の質向上を図りうる、当該基板および当該一方の導体を備えている電子回路基板および超音波接合方法を提供する。 PCB1は、基板10を構成する合成樹脂よりも高融点の材料により構成されている補強部材12を備えている。補強部材12を構成する第1補強部材121は、上面配線11に少なくとも部分的に重なって基板10に埋設されている略平板状または帯状の金属により構成されている。補強部材12を構成する第2補強部材122は、ビア111と同様に、上面配線11の下面に連結され、かつ、第1補強部材121に物理的、化学的または機械的に連結されている、上下に延在する略円柱状の金属により構成されている。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)