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1. (WO2017154639) SUBSTRATE PROCESSING DEVICE
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Pub. No.: WO/2017/154639 International Application No.: PCT/JP2017/007486
Publication Date: 14.09.2017 International Filing Date: 27.02.2017
IPC:
H01L 21/677 (2006.01) ,B65G 49/07 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67
Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
677
for conveying, e.g. between different work stations
B PERFORMING OPERATIONS; TRANSPORTING
65
CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
G
TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
49
Conveying systems characterised by their application for specified purposes not otherwise provided for
05
for fragile or damageable materials or articles
07
for semiconductor wafers
Applicants:
株式会社SCREENホールディングス SCREEN HOLDINGS CO., LTD. [JP/JP]; 京都府京都市上京区堀川通寺之内上る4丁目天神北町1番地の1 1-1, Tenjinkita-machi, Teranouchi-agaru 4-chome, Horikawa-dori, Kamigyo-ku, Kyoto-shi, Kyoto 6028585, JP
Inventors:
村元 僚 MURAMOTO, Ryo; JP
Agent:
特許業務法人あい特許事務所 AI ASSOCIATION OF PATENT AND TRADEMARK ATTORNEYS; 大阪府大阪市中央区南本町二丁目6番12号 サンマリオンNBFタワー21階 Sun Mullion NBF Tower, 21st Floor, 6-12, Minamihommachi 2-chome, Chuo-ku, Osaka-shi, Osaka 5410054, JP
Priority Data:
2016-04871411.03.2016JP
Title (EN) SUBSTRATE PROCESSING DEVICE
(FR) DISPOSITIF DE TRAITEMENT DE SUBSTRAT
(JA) 基板処理装置
Abstract:
(EN) In the present invention, a first transfer robot carries in and carries out a substrate with respect to a container. A second transfer robot transfers the substrate between the first transfer robot and the second transfer robot, and carries in and carries out the substrate with respect to a first processing unit through a first inlet/outlet port. A third transfer robot transfers the substrate between the second transfer robot and the third transfer robot, and carries in and carries out the substrate with respect to a second processing unit through a second inlet/outlet port, and carries in and caries out the substrate with respect to a third processing unit through a third inlet/outlet port.
(FR) Dans la présente invention, un premier robot de transfert transporte à l'intérieur et transporte à l'extérieur un substrat par rapport à un contenant. Un deuxième robot de transfert transfère le substrat entre le premier robot de transfert et le deuxième robot de transfert, et transporte à l'intérieur et transporte à l'extérieur le substrat par rapport à une première unité de traitement à travers un premier orifice d'entrée/de sortie. Un troisième robot de transfert transfère le substrat entre le deuxième robot de transfert et le troisième robot de transfert, et transporte à l'intérieur et transporte à l'extérieur le substrat par rapport à une deuxième unité de traitement à travers un deuxième orifice d'entrée/de sortie, et transporte à l'intérieur et transporte à l'extérieur le substrat par rapport à une troisième unité de traitement à travers un troisième orifice d'entrée/de sortie.
(JA) 第1搬送ロボットは、収容器に対して基板の搬入および搬出を行う。第2搬送ロボットは、第1搬送ロボットとの間で基板の受け渡しを行い、かつ第1出入口を介して第1処理部に対して基板の搬入および搬出を行う。第3搬送ロボットは、第2搬送ロボットとの間で基板の受け渡しを行い、第2出入口を介して第2処理部に対して基板の搬入および搬出を行い、第3出入口を介して第3処理部に対して基板の搬入および搬出を行う。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)