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1. (WO2017154599) SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING DEVICE

Pub. No.:    WO/2017/154599    International Application No.:    PCT/JP2017/006881
Publication Date: Fri Sep 15 01:59:59 CEST 2017 International Filing Date: Fri Feb 24 00:59:59 CET 2017
IPC: H01L 21/304
Applicants: SCREEN HOLDINGS CO., LTD.
株式会社SCREENホールディングス
Inventors: HASHIMOTO, Koji
橋本 光治
Title: SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING DEVICE
Abstract:
In the present invention, a low-surface-tension liquid is supplied from a low-surface-tension-liquid supply unit to the top surface of a substrate, and a liquid film of the low-surface-tension liquid is formed on the substrate. An opening is formed in a central region of a liquid film of an organic solvent, and the liquid film is removed from the top surface of the substrate by widening of the opening. A liquid adherence point set outside the opening is caused to move so as to follow the widening of the opening while the low-surface-tension liquid is supplied to the liquid film from the low-surface-tension-liquid supply unit toward the liquid adherence point. A drying region set within the opening and a facing surface of a drying head are caused to move so as to follow the widening of the opening while the facing surface is made to face the drying head to form a low-humidity space in the space between the facing surface and the drying region, the low-humidity space having a lower humidity than other spaces.