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1. (WO2017154453) BONDING WIRE

Pub. No.:    WO/2017/154453    International Application No.:    PCT/JP2017/004771
Publication Date: Fri Sep 15 01:59:59 CEST 2017 International Filing Date: Fri Feb 10 00:59:59 CET 2017
IPC: H01L 21/60
Applicants: TATSUTA ELECTRIC WIRE & CABLE CO., LTD.
タツタ電線株式会社
Inventors: DOI, Satoko
土居 聡子
Title: BONDING WIRE
Abstract:
Provided is a bonding wire with Ag as a principal component, wherein the bonding wire has high optical reflectance, and is excellent in terms of wire drawability, FAB formation, and thermal resistance. The total of the content of one type or two types of elements selected from Au and Pd is 0.5 mass% to 1.0 mass%, the Ca content is 50 mass ppm to 100 mass ppm, and the remainder is Ag.