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1. (WO2017154432) MULTILAYER LAMINATE AND METHOD FOR PRODUCING MULTILAYER PRINTED WIRING BOARD USING SAME

Pub. No.:    WO/2017/154432    International Application No.:    PCT/JP2017/003966
Publication Date: Fri Sep 15 01:59:59 CEST 2017 International Filing Date: Sat Feb 04 00:59:59 CET 2017
IPC: H05K 3/46
B32B 7/02
B32B 15/08
Applicants: MITSUI MINING & SMELTING CO., LTD.
三井金属鉱業株式会社
Inventors: YONEDA, Yoshihiro
米田 祥浩
Title: MULTILAYER LAMINATE AND METHOD FOR PRODUCING MULTILAYER PRINTED WIRING BOARD USING SAME
Abstract:
This multilayer laminate (10) is provided with: a central conductive layer (11a); a first dielectric layer (12a) and a second dielectric layer (12b), which are directly arranged on both surfaces of the central conductive layer (11a), respectively; a first outer conductive layer (13a) which is directly arranged on the outer surface of the first dielectric layer (12a); and a second outer conductive layer (13b) which is directly arranged on the outer surface of the second dielectric layer (12b). The first outer conductive layer (13a) and the second outer conductive layer (13b) form the outer surfaces of the multilayer laminate (10). The central conductive layer (11a) is formed in a solid state over the entire region of the multilayer laminate (10) in the in-plane direction. The variation in the thickness of the first dielectric layer (12a) and the variation in the thickness of the second dielectric layer (12b) are independently 15% or less.