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1. (WO2017154422) CONNECTION SUBSTRATE
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Pub. No.: WO/2017/154422 International Application No.: PCT/JP2017/003554
Publication Date: 14.09.2017 International Filing Date: 01.02.2017
IPC:
H05K 1/11 (2006.01) ,H01L 23/13 (2006.01)
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1
Printed circuits
02
Details
11
Printed elements for providing electric connections to or between printed circuits
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
12
Mountings, e.g. non-detachable insulating substrates
13
characterised by the shape
Applicants:
日本碍子株式会社 NGK INSULATORS, LTD. [JP/JP]; 愛知県名古屋市瑞穂区須田町2番56号 2-56, Suda-cho, Mizuho-ku, Nagoya-shi, Aichi 4678530, JP
Inventors:
宮澤 杉夫 MIYAZAWA Sugio; JP
高垣 達朗 TAKAGAKI Tatsuro; JP
井出 晃啓 IDE Akiyoshi; JP
Agent:
細田 益稔 HOSODA Masutoshi; JP
青木 純雄 AOKI Sumio; JP
Priority Data:
2016-04816511.03.2016JP
Title (EN) CONNECTION SUBSTRATE
(FR) SUBSTRAT DE LIAISON
(JA) 接続基板
Abstract:
(EN) This connection substrate is provided with: a ceramic substrate that is provided with a through hole; and a through conductor 11 that is provided in the through hole and has a first main surface 11a and a second main surface 11b. The through conductor 11 comprises: a metal porous body 20 which has first open pores 16A, 16D that are in communication with the first main surface 11a and second open pores 16B that are in communication with the second main surface 11b; first glass phases 17, 19 which are formed within the first open pores 16A, 16D; second glass phases 17B which are formed within the second open pores 16B; first voids 30 which are provided within the first open pores; and second voids 32 which are provided within the second open pores 16B. The first voids 30 are closed voids which are not in communication with the first main surface. The second voids 32 are open voids which are in communication with the second main surface 11b.
(FR) La présente invention concerne un substrat de liaison qui comporte : un substrat de céramique qui comporte un trou traversant ; et un conducteur traversant (11) qui est disposé dans le trou traversant et a une première surface principale (11a) et une seconde surface principale (11b). Le conducteur traversant (11) comprend : un corps poreux métallique (20) qui a des premiers ports ouverts (16A, 16B) qui sont en communication avec la première surface principale (11a) et des seconds ports ouverts (16B) qui sont en communication avec la seconde surface principale (11b) ; des premières phases de verre (17, 19) qui sont formées dans les premiers ports ouverts (16A, 16D) ; des secondes phases de verre (17B) qui sont formées dans les seconds ports ouverts (16B) ; des premiers espaces vides (30) qui sont prévus dans les premiers ports ouverts ; et des seconds espaces vides (32) qui sont prévus dans les seconds ports ouverts (16B). Les premiers espaces vides (30) sont des espaces vides fermés qui ne sont pas en communication avec la première surface principale. Les seconds espaces vides (32) sont des espaces vides ouverts qui sont en communication avec la seconde surface principale (11b).
(JA) 接続基板は、貫通孔が設けられているセラミック基板、および貫通孔中に設けられた貫通導体11であって、第一の主面11aと第二の主面11bとを有する貫通導体を備える。貫通導体11が、第一の主面11aに連通する第一の開気孔16A、16Dおよび第二の主面11bに連通する第二の開気孔16Bが設けられた金属多孔体20、第一の開気孔16A、16D内に形成された第一のガラス相17、19、第二の開気孔16B内に形成された第二のガラス相17B、第一の開気孔内に設けられた第一の空隙30、および第二の開気孔16B内に設けられた第二の空隙32を有する。第一の空隙30が第一の主面に連通しない閉空隙である。第二の空隙32が第二の主面11bに連通する開空隙である。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)