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1. (WO2017154304) SUBSTRATE TRANSFER METHOD AND SUBSTRATE TRANSFER DEVICE

Pub. No.:    WO/2017/154304    International Application No.:    PCT/JP2016/087443
Publication Date: Fri Sep 15 01:59:59 CEST 2017 International Filing Date: Fri Dec 16 00:59:59 CET 2016
IPC: H01L 21/683
B23K 26/38
H01L 21/301
H01L 21/304
Applicants: NITTO DENKO CORPORATION
日東電工株式会社
Inventors: MATSUSHITA Takao
松下 孝夫
YAMAMOTO Masayuki
山本 雅之
Title: SUBSTRATE TRANSFER METHOD AND SUBSTRATE TRANSFER DEVICE
Abstract:
In this invention, a mounting frame MF1 is held with an adhesive tape T1 placed thereunder, the adhesive tape T1 is cut away by following the external shape of a wafer W, and the cut-away adhesive tape T1 is recovered. The wafer W is supplied with a new ring frame f2, and a new adhesive tape T2 is adhered over the upper surfaces of the wafer W and the ring frame. Since the adhesive tape T1 in the excess portion on the outer side of the wafer W has been separated from the wafer W and recovered, adhesion between the adhesive tape T1 and the adhesive tape T2 during transfer can be avoided with certainty.