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1. (WO2017154288) Ni-PLATED COPPER OR COPPER ALLOY MATERIAL, AND CONNECTOR TERMINAL, CONNECTOR, AND ELECTRONIC COMPONENT IN WHICH SAME IS USED
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Pub. No.: WO/2017/154288 International Application No.: PCT/JP2016/085438
Publication Date: 14.09.2017 International Filing Date: 29.11.2016
IPC:
C25D 7/00 (2006.01) ,C25D 5/20 (2006.01) ,H01R 13/03 (2006.01)
C CHEMISTRY; METALLURGY
25
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
D
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; JOINING WORKPIECES BY ELECTROLYSIS; APPARATUS THEREFOR
7
Electroplating characterised by the article coated
C CHEMISTRY; METALLURGY
25
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
D
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; JOINING WORKPIECES BY ELECTROLYSIS; APPARATUS THEREFOR
5
Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
20
Electroplating using ultrasonics
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
R
ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
13
Details of coupling devices of the kinds covered by groups H01R12/7087
02
Contact members
03
characterised by the material, e.g. plating or coating materials
Applicants:
JX金属株式会社 JX NIPPON MINING & METALS CORPORATION [JP/JP]; 東京都千代田区大手町一丁目1番2号 1-2,Otemachi 1-chome,Chiyoda-ku, Tokyo 1008164, JP
Inventors:
遠藤 智 ENDO,Satoru; JP
Agent:
アクシス国際特許業務法人 AXIS PATENT INTERNATIONAL; 東京都港区新橋二丁目6番2号 新橋アイマークビル Shimbashi i-mark Bldg., 6-2 Shimbashi 2-Chome, Minato-ku, Tokyo 1050004, JP
Priority Data:
2016-04607409.03.2016JP
Title (EN) Ni-PLATED COPPER OR COPPER ALLOY MATERIAL, AND CONNECTOR TERMINAL, CONNECTOR, AND ELECTRONIC COMPONENT IN WHICH SAME IS USED
(FR) MATÉRIAU EN CUIVRE OU ALLIAGE DE CUIVRE PLAQUÉ DE Ni, ET BORNE DE CONNECTEUR, ET CONNECTEUR ET COMPOSANT ÉLECTRONIQUE DANS LESQUELS LEDIT MATÉRIAU EN CUIVRE OU LEDIT ALLIAGE DE CUIVRE EST UTILISÉ
(JA) Niめっき銅又は銅合金材、それを用いたコネクタ端子、コネクタ及び電子部品
Abstract:
(EN) Provided is an Ni-plated copper or copper alloy material having both exceptional hardness and bending resistance. Provided is an Ni-plated copper or copper alloy material in which the area ratio of crystals in the <001> plane orientation in a crystal plane parallel to the Ni plating surface is 15-35% as measured by electron backscatter diffraction (EBSD).
(FR) L'invention concerne un matériau en cuivre ou alliage de cuivre plaqué de Ni présentant une dureté et une résistance à la flexion toutes deux exceptionnelles. Dans le matériau en cuivre ou alliage de cuivre plaqué de Ni, la proportion surfacique de cristaux dans l'orientation du plan <001> dans un plan cristallin parallèle à la surface de placage de Ni, mesurée par diffraction d'électrons rétrodiffusés (EBSD), est de 15 à 35 %.
(JA) 硬さと耐折り曲げ性とがいずれも優れたNiめっき銅又は銅合金材を提供する。電子線後方散乱回折法(EBSD)により測定したNiめっき表面に平行な結晶面の中で<001>面方位の結晶の面積率が15~35%であるNiめっき銅又は銅合金材。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, KE, KG, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)