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1. (WO2017154242) SOLDER JOINING DEVICE AND SOLDER JOINING METHOD

Pub. No.:    WO/2017/154242    International Application No.:    PCT/JP2016/076332
Publication Date: Fri Sep 15 01:59:59 CEST 2017 International Filing Date: Thu Sep 08 01:59:59 CEST 2016
IPC: H05K 3/34
B23K 1/00
B23K 1/002
B23K 101/42
Applicants: TORAY ENGINEERING CO., LTD.
東レエンジニアリング株式会社
WONDER FUTURE CORPORATION
株式会社ワンダーフューチャーコーポレーション
Inventors: TAJIMA, Hisayoshi
田嶋 久容
SUGIYAMA, Kazuhiro
杉山 和弘
Title: SOLDER JOINING DEVICE AND SOLDER JOINING METHOD
Abstract:
In this invention, a coil 16, having a shape surrounding a predetermined region R on a base board 7 on which mounting components CP have been mounted, is disposed above or below the base board 7. A ferrite material 41 is disposed so as to face a region of interest T containing an electrode 21 and one of the mounting components CP which are to be heated. A magnetic flux F generated around the coil 16 is efficiently transmitted to the ferrite material 41 to become focused, and the focused magnetic flux F is irradiated in a vertical direction onto the region of interest T on the base board 7. Consequently, due to the performance of induction-heating being limited to the electrode 21 located within the range of the region of interest T on the base board 7, only the targeted electrode 21 and mounting component CP can be joined selectively with solder.