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1. (WO2017154195) SEMICONDUCTOR DEVICE
Latest bibliographic data on file with the International Bureau   

Pub. No.: WO/2017/154195 International Application No.: PCT/JP2016/057749
Publication Date: 14.09.2017 International Filing Date: 11.03.2016
Chapter 2 Demand Filed: 30.06.2016
IPC:
H01L 25/07 (2006.01) ,H01L 23/48 (2006.01) ,H01L 25/18 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25
Assemblies consisting of a plurality of individual semiconductor or other solid state devices
03
all the devices being of a type provided for in the same subgroup of groups H01L27/-H01L51/128
04
the devices not having separate containers
07
the devices being of a type provided for in group H01L29/78
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
48
Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25
Assemblies consisting of a plurality of individual semiconductor or other solid state devices
18
the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/-H01L51/160
Applicants:
新電元工業株式会社 SHINDENGEN ELECTRIC MANUFACTURING CO., LTD. [JP/JP]; 東京都千代田区大手町2丁目2番1号 2-1, Ohtemachi 2-chome, Chiyoda-ku, Tokyo 1000004, JP
Inventors:
神山 悦宏 KAMIYAMA Yoshihiro; JP
Agent:
棚井 澄雄 TANAI Sumio; JP
Priority Data:
Title (EN) SEMICONDUCTOR DEVICE
(FR) DISPOSITIF À SEMI-CONDUCTEURS
(JA) 半導体装置
Abstract:
(EN) This semiconductor device (10) is provided with at least one circuit unit (41, 42, 43) that has a device body (20) and a power source terminal (31, 32, 33), output terminal (34, 35, 36), and ground terminal (37, 38, 39) that protrude from the device body (20), wherein the output terminal (34, 35, 36) and the ground terminal (37, 38, 39) protrude in mutually opposing directions with respect to the device body (20), and the power source terminal (31, 32, 33) protrudes in the same direction as the ground terminal (37, 38, 39) and is positioned so as to be offset in a direction that is orthogonal to the direction of arrangement of the output terminal (34, 35, 36) and ground terminal (37, 38, 39).
(FR) La présente invention concerne un dispositif à semi-conducteurs (10) qui comporte au moins une unité de circuit (41, 42, 43) qui a un corps de dispositif (20) et une borne de source d’alimentation (31, 32, 33), une borne de sortie (34, 35, 36), et une borne de terre (37, 38, 39) qui font saillie à partir du corps de dispositif (20), la borne de sortie (34, 35, 36) et la borne de terre (37, 38, 39) faisant saillie dans des directions mutuellement opposées par rapport au corps de dispositif (20), et la borne de source d’alimentation (31, 32, 33) faisant saillie dans la même direction que la borne de terre (37, 38, 39) et étant positionnée de façon à être décalée dans une direction qui est orthogonale à la direction d’agencement de la borne de sortie (34, 35, 36) et de la borne de terre (37, 38, 39).
(JA) 本発明の半導体装置(10)は、装置本体(20)と、装置本体(20)から突出する電源端子(31,32,33)、出力端子(34,35,36)及びグランド端子(37,38,39)と、を有する回路ユニット(41,42,43)を少なくとも1つ備え、出力端子(34,35,36)とグランド端子(37,38,39)とが、装置本体(20)に対して互いに逆向きに突出し、電源端子(31,32,33)は、グランド端子(37,38,39)と同じ向きに突出すると共に、出力端子(34,35,36)及びグランド端子(37,38,39)の配列方向に直交する方向にずれて位置する。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)