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1. (WO2017154085) CONVEYANCE PAD, AND CONVEYANCE DEVICE AND CONVEYANCE METHOD USING SAME
Latest bibliographic data on file with the International Bureau   

Pub. No.: WO/2017/154085 International Application No.: PCT/JP2016/057065
Publication Date: 14.09.2017 International Filing Date: 08.03.2016
IPC:
B25J 15/06 (2006.01) ,B65G 49/07 (2006.01) ,H01L 21/677 (2006.01)
B PERFORMING OPERATIONS; TRANSPORTING
25
HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; HANDLES FOR HAND IMPLEMENTS; WORKSHOP EQUIPMENT; MANIPULATORS
J
MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
15
Gripping heads
06
with vacuum or magnetic holding means
B PERFORMING OPERATIONS; TRANSPORTING
65
CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
G
TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
49
Conveying systems characterised by their application for specified purposes not otherwise provided for
05
for fragile or damageable materials or articles
07
for semiconductor wafers
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67
Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
677
for conveying, e.g. between different work stations
Applicants:
株式会社ナノテム NANO TEM CO., LTD. [JP/JP]; 新潟県長岡市城岡3丁目2番地10号 2-10, Jyooka 3-chome, Nagaoka-shi, Niigata 9400021, JP
Inventors:
高田 篤 TAKATA, Atsushi; JP
高津 雅一 TAKATSU, Masakazu; JP
大橋 恭介 OHASHI, Kyosuke; JP
石崎 幸三 ISHIZAKI, Kozo; JP
小野寺 徳朗 ONODERA, Norio; JP
Agent:
栗林 三男 KURIBAYASHI, Mitsuo; JP
Priority Data:
Title (EN) CONVEYANCE PAD, AND CONVEYANCE DEVICE AND CONVEYANCE METHOD USING SAME
(FR) TAMPON DE TRANSPORT, ET DISPOSITIF DE TRANSPORT ET PROCÉDÉ DE TRANSPORT UTILISANT UN TEL TAMPON
(JA) 搬送用パッドおよびそれを用いる搬送装置、搬送方法
Abstract:
(EN) Provided are: a conveyance pad capable of reliably adhering and fixing or floating and contactlessly conveying an object to be conveyed that is loaded on a portion of a conveyance surface by means of the affixing force or floating force of the conveyance pad; and a conveyance device and a conveyance method using same. The conveyance pad (2) is obtained from a porous substrate having multiple air holes passing therethrough. An object (W) being conveyed that is loaded on the front surface of the conveyance pad (2) is affixed or floated by depressurizing or pressurizing the back surface of the conveyance pad (2). The relationship between the area ratio α of the surface of the conveyance pad (2) covered by the object being conveyed and the conductance ratio β satisfies a specific relational formula.
(FR) La présente invention concerne: un tampon de transport capable d'adhérence et de fixation ou de suspension fiable et de transport sans contact d'un objet à transporter qui est chargé sur une partie d'une surface de transport au moyen de la force de fixation ou de la force de suspension du tampon de transport; et un dispositif de transport et un procédé de transport utilisant un tel tampon. Le tampon de transport (2) est réalisé à partir d'un substrat poreux comprenant une pluralité de trous d'air débouchants. Un objet (W) transporté qui est chargé sur la surface avant du tampon de transport (2) est fixé ou suspendu par dépressurisation ou mise sous pression de la surface arrière du tampon de transport (2). La relation entre le rapport de surface α de la surface du tampon de transport (2) recouverte par l'objet transporté et le rapport de conductance β satisfait une équation spécifique.
(JA) 搬送用パッドの吸着力もしくは浮上力により、搬送面の一部に載置される搬送物を確実に吸着して固定させ、もしくは浮上させて非接触搬送することができる搬送用パッドおよびそれを用いる搬送装置、搬送方法を提供する。 この搬送用パッド(2)は、多数の気孔によって連通する多孔性基板からなり、前記搬送用パッド(2)の背面側を減圧もしくは加圧することにより、該搬送用パッド(2)の表面側に載置される搬送物(W)を吸着もしくは浮上させ、前記搬送用パッド(2)の表面を覆う搬送物の面積率αと、コンダクタンス比βとの関係が特定の関係式を満足する。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)