Some content of this application is unavailable at the moment.
If this situation persist, please contact us atFeedback&Contact
1. (WO2017153750) METHOD OF REDUCING PHOTOELECTRON YIELD AND/OR SECONDARY ELECTRON YIELD OF A CERAMIC SURFACE; CORRESPONDING APPARATUS AND PRODUCT
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.: WO/2017/153750 International Application No.: PCT/GB2017/050621
Publication Date: 14.09.2017 International Filing Date: 08.03.2017
IPC:
B23K 26/00 (2014.01) ,B23K 26/0622 (2014.01) ,B23K 26/082 (2014.01) ,B23K 26/352 (2014.01) ,B23K 103/04 (2006.01) ,B23K 103/10 (2006.01) ,B23K 103/12 (2006.01) ,B23K 103/14 (2006.01) ,B23K 101/32 (2006.01) ,B23K 101/36 (2006.01) ,B23K 103/00 (2006.01)
B PERFORMING OPERATIONS; TRANSPORTING
23
MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
K
SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26
Working by laser beam, e.g. welding, cutting, boring
[IPC code unknown for B23K 26/0622][IPC code unknown for B23K 26/082][IPC code unknown for B23K 26/352]
B PERFORMING OPERATIONS; TRANSPORTING
23
MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
K
SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
103
Materials to be soldered, welded or cut
02
Iron or ferrous alloys
04
Steel alloys
B PERFORMING OPERATIONS; TRANSPORTING
23
MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
K
SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
103
Materials to be soldered, welded or cut
08
Non-ferrous metals or alloys
10
Aluminium or alloys thereof
B PERFORMING OPERATIONS; TRANSPORTING
23
MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
K
SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
103
Materials to be soldered, welded or cut
08
Non-ferrous metals or alloys
12
Copper or alloys thereof
B PERFORMING OPERATIONS; TRANSPORTING
23
MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
K
SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
103
Materials to be soldered, welded or cut
08
Non-ferrous metals or alloys
14
Titanium or alloys thereof
B PERFORMING OPERATIONS; TRANSPORTING
23
MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
K
SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
101
Articles made by soldering, welding or cutting
32
Wires
B PERFORMING OPERATIONS; TRANSPORTING
23
MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
K
SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
101
Articles made by soldering, welding or cutting
36
Electric or electronic devices
B PERFORMING OPERATIONS; TRANSPORTING
23
MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
K
SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
103
Materials to be soldered, welded or cut
Applicants:
UNIVERSITY OF DUNDEE [GB/GB]; Nethergate Dundee DD1 4HN, GB
Inventors:
ABDOLVAND, Amin; GB
Agent:
HARGREAVES, Timothy Edward; GB
Priority Data:
1603991.908.03.2016GB
Title (EN) METHOD OF REDUCING PHOTOELECTRON YIELD AND/OR SECONDARY ELECTRON YIELD OF A CERAMIC SURFACE; CORRESPONDING APPARATUS AND PRODUCT
(FR) PROCÉDÉ DE RÉDUCTION DE RENDEMENT DE PHOTOÉLECTRON ET/OU DE RENDEMENT D'ÉLECTRON SECONDAIRE DE SURFACE CÉRAMIQUE; APPAREIL ET PRODUIT CORRESPONDANTS
Abstract:
(EN) A method of reducing photoelectron yield (PEY) and/or secondary electron yield (SEY) of a ceramic surface comprises applying pulsed laser radiation comprising a series of laser pulses emitted by a laser (4) to the surface of a target (10) to produce a periodic arrangement of structures on the surface of the target (10).
(FR) L'invention concerne un procédé de réduction de rendement de photoélectron (PEY) et/ou de rendement d'électron secondaire (SEY) d'une surface céramique, qui consiste à appliquer un rayonnement laser pulsé comprenant une série d'impulsions laser émises par un laser (4) à la surface d'une cible (10) pour produire un agencement périodique de structures sur la surface de la cible (10).
front page image
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)