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1. (WO2017153585) LED MODULE WITH SILICON LENSES
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Pub. No.: WO/2017/153585 International Application No.: PCT/EP2017/055709
Publication Date: 14.09.2017 International Filing Date: 10.03.2017
IPC:
H01L 25/075 (2006.01) ,H01L 33/00 (2010.01) ,H01L 33/54 (2010.01) ,H01L 33/56 (2010.01) ,H01L 33/58 (2010.01) ,H01L 33/44 (2010.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25
Assemblies consisting of a plurality of individual semiconductor or other solid state devices
03
all the devices being of a type provided for in the same subgroup of groups H01L27/-H01L51/128
04
the devices not having separate containers
075
the devices being of a type provided for in group H01L33/78
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33
Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33
Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48
characterised by the semiconductor body packages
52
Encapsulations
54
having a particular shape
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33
Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48
characterised by the semiconductor body packages
52
Encapsulations
56
Materials, e.g. epoxy or silicone resin
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33
Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48
characterised by the semiconductor body packages
58
Optical field-shaping elements
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33
Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
44
characterised by the coatings, e.g. passivation layer or anti-reflective coating
Applicants:
SITECO BELEUCHTUNGSTECHNIK GMBH [DE/DE]; Georg-Simon-Ohmstr. 50 83301 Traunreut, DE
Inventors:
TEKLAK, Janusz; DE
ETTL, Sebastian; DE
Agent:
SCHMIDT, Steffen; DE
Priority Data:
10 2016 104 546.211.03.2016DE
Title (EN) LED MODULE WITH SILICON LENSES
(FR) MODULE DE DEL POURVU DE LENTILLES EN SILICONE
(DE) LED-MODUL MIT SILIKONLINSEN
Abstract:
(EN) The invention relates to an LED module comprising: a carrier plate (1) made from a carbon-based polymer; lens elements (9) made of silicone (3) and which are connected to the carrier plate (1); and several LED's (5) which are arranged in cut-outs of the carrier plate (1), each of the lens elements (9) being associated with respectively one LED (5). The invention also relates to a method for producing said type of LED module wherein, in a method step, the lens elements (9) are formed by injecting silicone material into a mould (2) in which the carrier plate (1) is arranged.
(FR) L'invention concerne un module de DEL comprenant : une plaque de support (1) constituée d'un polymère à base de carbone; des éléments lentilles (9) en silicone (3), reliés à la plaque de support (1); et plusieurs DEL (5) disposées dans des encoches de la plaque de support (1), une DEL (5) étant associée respectivement à chacun des éléments lentilles (9). L'invention concerne en outre un procédé de production d'un tel module de DEL, une des étapes dudit procédé consistant à former les éléments lentilles (9) par injection de matériau de silicone dans un moule (2) dans lequel est placée la plaque de support (1).
(DE) Die Erfindung betrifft ein LED-Modul, umfassend: eine Trägerplatte (1) aus einem kohlenstoffbasierten Polymer; Linsenelemente (9) aus Silikon (3), welche mit der Trägerplatte (1) verbunden sind; und mehrere LEDs (5), welche in Ausschnitten der Trägerplatte (1) angeordnet sind, wobei jedem der Linsenelemente (9) jeweils eine LED (5) zugeordnet ist. Weiterhin betrifft die Erfindung ein Verfahren zur Herstellung eines solchen LED-Moduls, wobei in einem Verfahrensschritt die Linsenelemente (9) durch einspritzen von Silikonmaterial in ein Werkzeug (2), in dem die Trägerplatte (1) angeordnet ist, gebildet werden.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: German (DE)
Filing Language: German (DE)