Search International and National Patent Collections

1. (WO2017153353) METHOD FOR PRODUCING A MODULE WITH AN INTEGRATED CIRCUIT CHIP AND DEVICE COMPRISING SUCH A MODULE

Pub. No.:    WO/2017/153353    International Application No.:    PCT/EP2017/055218
Publication Date: Fri Sep 15 01:59:59 CEST 2017 International Filing Date: Tue Mar 07 00:59:59 CET 2017
IPC: G06K 19/077
Applicants: GEMALTO SA
Inventors: OTTOBON, Stéphane
CHARLES, Luc
LAVIRON, Thierry
DOSSETTO, Lucile
Title: METHOD FOR PRODUCING A MODULE WITH AN INTEGRATED CIRCUIT CHIP AND DEVICE COMPRISING SUCH A MODULE
Abstract:
A method for producing a device (1) comprising or constituting an electronic module (1A, 1B, 1C), said module comprising an integrated circuit chip (12) having electrical contact pads (12a, 12b), an insulating material (2) covering at least each pad (12a, 12b), and a projecting interconnection portion (31a, 32a) of an electrical element, connected to each contact pad and extending outwards. The method is characterised in that each projecting interconnection portion (31a, 32a) is configured to have an interconnection width greater than 100 μm or greater than or equal to the width of each electrical contact pad (12a, 12b). The invention also relates to a module obtained thereby and to a device comprising same.