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1. (WO2017152958) CHAMBER FOR DEGASSING SUBSTRATES
Latest bibliographic data on file with the International Bureau   

Pub. No.: WO/2017/152958 International Application No.: PCT/EP2016/054909
Publication Date: 14.09.2017 International Filing Date: 08.03.2016
IPC:
H01L 21/67 (2006.01) ,H01L 21/673 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67
Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67
Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
673
using specially adapted carriers
Applicants:
EVATEC AG [CH/CH]; Hauptstrasse 1a 9477 Trübbach, CH
Inventors:
LODDER, Rogier; CH
SCHÄFER, Martin; CH
WEICHART, Jürgen; LI
Agent:
TROESCH SCHEIDEGGER WERNER AG; Jacques Troesch Schwäntenmos 14 8126 Zumikon, CH
Priority Data:
Title (EN) CHAMBER FOR DEGASSING SUBSTRATES
(FR) CHAMBRE POUR DÉGAZER DES SUBSTRATS
Abstract:
(EN) A heater and/or cooler chamber (1) comprises a heat storage block or chunk (3). In the block a multitude of parallel, stacked slit pockets (17) each dimensioned to accommodate a single plate shaped workpiece. Workpiece handling openings (11) of the slit pockets (7) are freed and respectively covered by a door arrangement (13). The slit pockets (7) are tailored to snuggly surround the plate shaped workpieces therein so as to establish an efficient heat transfer between the heat storage block or chunk (3) and the workpieces to be cooled or heated.
(FR) L’invention concerne une chambre d’élément chauffant et/ou d’élément de refroidissement (1) qui comprend un bloc ou un segment de stockage de chaleur (3). Dans le bloc, une multitude de poches à fente empilées et parallèles (17) sont dimensionnées chacune pour recevoir une pièce à usiner en forme de plaque unique. Des ouvertures de manipulation de pièce à usiner (11) des poches à fente (7) sont libérées et recouvertes respectivement par un agencement de porte (13). Les poches à fente (7) sont conçues pour enserrer les pièces à usiner en forme de plaque dans celles-ci de façon à établir un transfert de chaleur efficace entre le bloc ou le segment de stockage de chaleur (3) et les pièces à usiner à refroidir ou à chauffer.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)