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1. (WO2017152828) DISTRIBUTED PATTERN PROCESSOR CONTAINING THREE-DIMENSIONAL MEMORY ARRAY

Pub. No.:    WO/2017/152828    International Application No.:    PCT/CN2017/075866
Publication Date: Fri Sep 15 01:59:59 CEST 2017 International Filing Date: Wed Mar 08 00:59:59 CET 2017
IPC: H04L 27/10
G11C 17/10
Applicants: CHENGDU HAICUN IP TECHNOLOGY LLC
成都海存艾匹科技有限公司
Inventors: ZHANG, Guobiao
张国飙
Title: DISTRIBUTED PATTERN PROCESSOR CONTAINING THREE-DIMENSIONAL MEMORY ARRAY
Abstract:
Proposed is a distributed pattern processor containing a three-dimensional memory (3D-M) array. The distributed pattern processor contains a plurality of memory processing units, wherein each unit contains a pattern processing circuit and at least one 3D-M array storing at least one pattern. The 3D-M array is stacked above the pattern processing circuit. By adopting large-scale parallel calculation, a distributed pattern processor can realize rapid pattern processing for a large pattern base.