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|1. (WO2017152714) CARRIER AND MANUFACTURING METHOD THEREFOR, AND METHOD FOR MANUFACTURING CORE-LESS PACKAGE SUBSTRATE USING CARRIER|
|Applicants:||RICHVIEW ELECTRONICS CO., LTD.
|Title:||CARRIER AND MANUFACTURING METHOD THEREFOR, AND METHOD FOR MANUFACTURING CORE-LESS PACKAGE SUBSTRATE USING CARRIER|
Provided are a carrier (10) and a manufacturing method therefor, and a method for manufacturing a core-less package substrate using the carrier (10). The method for manufacturing the carrier (10), which is used in the core-less package substrate (100), comprises: step S1, forming a cured resin (12); and step S2, forming an easily-strippable conductor layer (16) on the surface (14) of the cured resin (12), wherein the binding force between the conductor layer (16) and the cured resin (12) is 0.01-0.05 N/mm.