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1. (WO2017152714) CARRIER AND MANUFACTURING METHOD THEREFOR, AND METHOD FOR MANUFACTURING CORE-LESS PACKAGE SUBSTRATE USING CARRIER

Pub. No.:    WO/2017/152714    International Application No.:    PCT/CN2017/070881
Publication Date: Fri Sep 15 01:59:59 CEST 2017 International Filing Date: Thu Jan 12 00:59:59 CET 2017
IPC: H01L 21/58
H01L 23/12
Applicants: RICHVIEW ELECTRONICS CO., LTD.
武汉光谷创元电子有限公司
Inventors: ZHANG, Zhiqiang
张志强
BAI, Siping
白四平
YANG, Zhigang
杨志刚
CHENG, Wenze
程文则
Title: CARRIER AND MANUFACTURING METHOD THEREFOR, AND METHOD FOR MANUFACTURING CORE-LESS PACKAGE SUBSTRATE USING CARRIER
Abstract:
Provided are a carrier (10) and a manufacturing method therefor, and a method for manufacturing a core-less package substrate using the carrier (10). The method for manufacturing the carrier (10), which is used in the core-less package substrate (100), comprises: step S1, forming a cured resin (12); and step S2, forming an easily-strippable conductor layer (16) on the surface (14) of the cured resin (12), wherein the binding force between the conductor layer (16) and the cured resin (12) is 0.01-0.05 N/mm.