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1. (WO2017152602) HALOGEN-FREE THERMOSETTING RESIN COMPOSITION, AND PREPREG AND LAMINATE FOR PRINTED CIRCUITS USING SAME

Pub. No.:    WO/2017/152602    International Application No.:    PCT/CN2016/098450
Publication Date: Fri Sep 15 01:59:59 CEST 2017 International Filing Date: Fri Sep 09 01:59:59 CEST 2016
IPC: C08L 63/00
C08G 59/40
C08L 85/02
Applicants: SHENGYI TECHNOLOGY CO., LTD.
广东生益科技股份有限公司
Inventors: LUO, Cheng
罗成
TANG, Guofang
唐国坊
Title: HALOGEN-FREE THERMOSETTING RESIN COMPOSITION, AND PREPREG AND LAMINATE FOR PRINTED CIRCUITS USING SAME
Abstract:
Provided are a halogen-free thermosetting resin composition, and a prepreg and laminate for printed circuits using same. The halogen-free thermosetting resin composition comprises, based on 100 parts by weight of organic solids: (A) 5-50 parts of a cyanate resin; (B) 5-40 parts of a polyphenyl ether resin; (C) 5-30 parts of a phosphorus-containing bisphenol polymer; and (D) 30-60 parts of a halogen-free epoxy resin. The prepreg and laminate for printed circuits prepared from the halogen-free thermosetting resin composition provided have a high glass transition temperature, excellent dielectric properties, low water absorption, high thermal resistance, high peel strength, excellent heat and humidity resistance and good processability, and can achieve halogen-free flame retardancy and reach the UL94 V-0 grade.