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1. (WO2017152477) APPARATUS FOR IMPLEMENTING IMPEDANCE MATCHING AND POWER DISTRIBUTION, AND SEMICONDUCTOR PROCESSING DEVICE
Latest bibliographic data on file with the International Bureau   

Pub. No.: WO/2017/152477 International Application No.: PCT/CN2016/080366
Publication Date: 14.09.2017 International Filing Date: 27.04.2016
IPC:
H01J 37/32 (2006.01) ,H01L 21/302 (2006.01) ,H01L 21/67 (2006.01) ,H03H 7/38 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
J
ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
37
Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
32
Gas-filled discharge tubes
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
04
the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
18
the devices having semiconductor bodies comprising elements of the fourth group of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
30
Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20-H01L21/26142
302
to change the physical characteristics of their surfaces, or to change their shape, e.g. etching, polishing, cutting
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67
Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H ELECTRICITY
03
BASIC ELECTRONIC CIRCUITRY
H
IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
7
Multiple-port networks comprising only passive electrical elements as network components
38
Impedance-matching networks
Applicants:
北京北方微电子基地设备工艺研究中心有限责任公司 BEIJING NMC CO., LTD. [CN/CN]; 中国北京市 北京经济技术开发区文昌大道8号 NO.8 Wenchang Avenue Beijing Economic-Technological Development Area, Beijing 100176, CN
Inventors:
成晓阳 CHENG, Xiaoyang; CN
韦刚 WEI, Gang; CN
卫晶 WEI, Jing; CN
李兴存 LI, Xingcun; CN
Agent:
北京天昊联合知识产权代理有限公司 TEE&HOWE INTELLECTUAL PROPERTY ATTORNEYS; 中国北京市 东城区建国门内大街28号民生金融中心D座10层张天舒 Tianshu ZHANG 10th Floor, Tower D, Minsheng Financial Center, 28 Jianguomennei Avenue, Dongcheng District Beijing 100005, CN
Priority Data:
201610140056.611.03.2016CN
Title (EN) APPARATUS FOR IMPLEMENTING IMPEDANCE MATCHING AND POWER DISTRIBUTION, AND SEMICONDUCTOR PROCESSING DEVICE
(FR) APPAREIL DE MISE EN ŒUVRE D'ADAPTATION D'IMPÉDANCE ET DE DISTRIBUTION D'ÉNERGIE, ET DISPOSITIF DE TRAITEMENT SEMI-CONDUCTEUR
(ZH) 用于实现阻抗匹配和功率分配的装置及半导体加工设备
Abstract:
(EN) The present invention provides an apparatus for implementing impedance matching and power distribution, and a semiconductor processing device. The apparatus comprises a power distribution circuit and an impedance matching circuit. An input end of the impedance matching circuit is used for being electrically connected to a radio frequency power supply. The power distribution circuit comprises at least two branches, and each branch comprises an upstream end and a downstream end. The upstream end of each branch is connected to an output end of the impedance matching circuit, and the downstream end of each branch is used for being connected to an external component. Each branch is serially connected to a power distribution unit, and the power distribution unit only comprises one first adjustable capacitor. The apparatus and the semiconductor processing device provided in the present invention have low costs, high integration and small volumes.
(FR) La présente invention concerne un appareil de mise en œuvre d'adaptation d'impédance et de distribution d'énergie, et un dispositif de traitement semi-conducteur. L'appareil comprend un circuit de distribution d'énergie et un circuit d'adaptation d'impédance. Une extrémité d'entrée du circuit d'adaptation d'impédance est utilisée pour être connectée électriquement à une alimentation électrique à radiofréquences. Le circuit de distribution d'énergie comprend au moins deux branches, et chaque branche comprend une extrémité amont et une extrémité aval. L'extrémité amont de chaque branche est connectée à une extrémité de sortie du circuit d'adaptation d'impédance, et l'extrémité aval de chaque branche est utilisée pour être connectée à un composant extérieur. Chaque branche est connectée en série à une unité de distribution d'énergie, et l'unité de distribution d'énergie comprend uniquement un premier condensateur réglable. L'appareil et le dispositif de traitement semi-conducteur selon la présente invention ont des coûts faibles, une bonne intégration et un petit volume.
(ZH) 本发明提供了一种用于实现阻抗匹配和功率分配的装置及半导体加工设备。该装置包括功率分配电路和阻抗匹配电路,所述阻抗匹配电路的输入端用于与射频电源电连接,所述功率分配电路包括至少两条支路,每条所述支路包括上游端和下游端,每条所述支路的上游端与所述阻抗匹配电路的输出端相连,且其下游端用于与外接器件相连,每条所述支路上均串联有功率分配单元,所述功率分配单元仅包括一个第一可调电容。本发明提供的装置及半导体加工设备,不仅成本低,而且集成度高,体积减小。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Chinese (ZH)
Filing Language: Chinese (ZH)