A backlight module and a liquid crystal display. The backlight module comprises an LED light source (1) and a lens strip (102). The LED light source (1) is disposed on an LED substrate and comprises multiple LED lamp beads (1011), and the LED lamp beads (1011) are packaged by means of a chip scale packaging technology. The lens strip (102) is disposed in front of the LED light source (1), multiple cavities (1021) are disposed in the LED lamp strip (102), the inner walls (10211) of the cavities (1021) are parabola curved surfaces, each LED lamp bead (1011) is located at the position of a focus (A) formed close to the parabola curved surface of each cavity (1021). Accordingly, the parabola curved surfaces are symmetrical to each other on the upper and lower sides of the lamp beads (1011), and when an LED (1) emits light rays to multiple directions, the light rays in the multiple directions are focused to be emergent right ahead by the cavities (1021). In this way, the utilization of light rays when CSP packaging is used on the sides can be increased, and the light leakage problem can be well resolved.