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1. (WO2017152353) PHASE CHANGE MATERIAL
Latest bibliographic data on file with the International Bureau   

Pub. No.: WO/2017/152353 International Application No.: PCT/CN2016/075827
Publication Date: 14.09.2017 International Filing Date: 08.03.2016
IPC:
C09K 5/00 (2006.01)
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
K
MATERIALS FOR APPLICATIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
5
Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
Applicants:
ZHANG, Bright [CN/US]; US (US)
WANG, Wei Jun [CN/US]; US (US)
LIU, Ya Qun [CN/US]; US (US)
HUANG, Hong Min [CN/US]; US (US)
HONEYWELL INTERNATIONAL INC. [US/US]; 115 Tabor Road, M/S 4D3 Morris Plains, New Jersey 07950, US
Inventors:
ZHANG, Bright; US
WANG, Wei Jun; US
LIU, Ya Qun; US
HUANG, Hong Min; US
Agent:
CHINA PATENT AGENT (H.K.) LTD.; 22/F., Great Eagle Center 23 Harbour Road Wanchai Hong Kong, CN
Priority Data:
Title (EN) PHASE CHANGE MATERIAL
(FR) MATÉRIAU À CHANGEMENT DE PHASE
Abstract:
(EN) A thermal interface material includes, in one exemplary embodiment, at least one polymer, at least one phase change material, at least one crosslinker, and at least one thermally conductive filler. The at least one thermally conductive includes a first plurality of particles having a particle diameter of about 1 micron or less. The at least one thermally conductive filler comprises at least 80wt.% of the total weight of the thermal interface material. A formulation for forming a thermal interface material and an electronic component including a thermal interface material are also provided.
(FR) L'invention concerne un matériau à changement de phase comprenant, dans un exemple de mode de réalisation, au moins un polymère, au moins un matériau à changement de phase, au moins un agent réticulant et au moins une charge thermoconductrice. Ladite charge thermoconductrice comprend une première pluralité de particules ayant un diamètre particulaire d'environ 1 micron ou moins. Ladite charge thermoconductrice comprend au moins 80 % en poids du poids total du matériau d'interface thermique. L'invention concerne également une formulation permettant de former un matériau d'interface thermique et un composant électronique comprenant un matériau d'interface thermique.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)