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1. (WO2017152299) WATER COOLING HEAT SINK

Pub. No.:    WO/2017/152299    International Application No.:    PCT/CN2016/000118
Publication Date: Fri Sep 15 01:59:59 CEST 2017 International Filing Date: Wed Mar 09 00:59:59 CET 2016
IPC: H05K 7/20
Applicants: XU, Haijun
徐海军
Inventors: XU, Haijun
徐海军
Title: WATER COOLING HEAT SINK
Abstract:
A water cooling heat sink comprises a water cooling substrate (1), a water cooling pipe (4) and soldering tin (7). The water cooling pipe (4) penetrates from one end of the water cooling substrate (1) into an inner through-hole (5) of the water cooling substrate (1). The soldering tin (7) is then placed into a long groove (2) on an upper surface of the water cooling substrate (1). Then, the soldering tin is melted, so that the molten soldering tin fills the gap between the water cooling substrate (1) and the water cooling pipe (4), and that a seamless whole structure is formed between the water cooling substrate (1) and the water cooling pipe (4).