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1. (WO2017151231) THERMAL CONTROL OF A PROBE CARD ASSEMBLY
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Pub. No.: WO/2017/151231 International Application No.: PCT/US2017/013729
Publication Date: 08.09.2017 International Filing Date: 17.01.2017
IPC:
G01R 1/44 (2006.01) ,G01R 1/073 (2006.01) ,G01R 31/26 (2014.01) ,G01R 31/27 (2006.01)
G PHYSICS
01
MEASURING; TESTING
R
MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
1
Details of instruments or arrangements of the types covered by groups G01R5/-G01R13/122
44
Modifications of instruments for temperature compensation
G PHYSICS
01
MEASURING; TESTING
R
MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
1
Details of instruments or arrangements of the types covered by groups G01R5/-G01R13/122
02
General constructional details
06
Measuring leads; Measuring probes
067
Measuring probes
073
Multiple probes
G PHYSICS
01
MEASURING; TESTING
R
MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
31
Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
26
Testing of individual semiconductor devices
G PHYSICS
01
MEASURING; TESTING
R
MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
31
Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
26
Testing of individual semiconductor devices
27
Testing of devices without physical removal from the circuit of which they form part, e.g. compensating for effects due to surrounding elements
Applicants:
TERADYNE, INC. [US/US]; 600 Riverpark Drive North Reading, Massachusetts 01864, US
Inventors:
THOMPSON, Kevin A.; US
SILVA, Isaac N.; US
Agent:
PYSHER, Paul A.; US
AUGST, Alexander D.; US
BUTEAU, Kristen C.; US
CAHILL, John J.; US
HAULBROOK, William R.; US
JARRELL, Brenda Herschbach; US
KLEIN, Daniel A.; US
LI, Xiaodong; US
LYON, Charles E.; US
MEDINA, Rolando; US
MONROE, Margo R.; US
NGUYEN, Suzanne P.; US
NIHAN, Danielle M.; US
PACE, Nicholas J.; US
PELLIGRINO, Jeffrey S.; US
REARICK, John P.; US
REESE, Brian E.; US
ROHLFS, Elizabeth M.; US
SAHR, Robert N.; US
SCHONEWALD, Stephanie L.; US
SHAIKH, Nishat A.; US
SHINALL, Michael A.; US
SMITH, Maria C.; US
SUH, Su Kyung; US
VETTER, Michael L.; US
VRABLIK, Tracy L.; US
WANG, Gang; US
Priority Data:
15/056,78929.02.2016US
Title (EN) THERMAL CONTROL OF A PROBE CARD ASSEMBLY
(FR) RÉGULATION THERMIQUE D'UN ENSEMBLE CARTE DE SONDE
Abstract:
(EN) An example test system includes a test head and a probe card assembly connected to the test head. The probe card assembly includes: a probe card having electrical contacts, a stiffener connected to the probe card to impart rigidity to the probe card, and a heater to heat to at least part of the probe card assembly. A prober is configured to move a device under test (DUT) into contact with the electrical contacts of the probe card assembly.
(FR) L'invention concerne un système de test à titre d'exemple qui comprend une tête de test et un ensemble carte de sonde relié à la tête de test. L'ensemble carte de sonde comprend : une carte de sonde ayant des contacts électriques, un raidisseur connecté à la carte de sonde pour conférer une rigidité à la carte de sonde, et un dispositif de chauffage pour chauffer au moins une partie de l'ensemble carte de sonde. Un sondeur est configuré pour amener un dispositif à l'essai (DUT) en contact avec les contacts électriques de l'ensemble carte de sonde.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)