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1. (WO2017150676) ADHESIVE TAPE FOR SEMICONDUCTOR PROCESSING AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.: WO/2017/150676 International Application No.: PCT/JP2017/008314
Publication Date: 08.09.2017 International Filing Date: 02.03.2017
IPC:
H01L 21/301 (2006.01) ,C09J 7/02 (2006.01) ,C09J 133/04 (2006.01) ,H01L 21/304 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
04
the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
18
the devices having semiconductor bodies comprising elements of the fourth group of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
30
Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20-H01L21/26142
301
to subdivide a semiconductor body into separate parts, e.g. making partitions
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
J
ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
7
Adhesives in the form of films or foils
02
on carriers
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
J
ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
133
Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
04
Homopolymers or copolymers of esters
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
04
the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
18
the devices having semiconductor bodies comprising elements of the fourth group of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
30
Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20-H01L21/26142
302
to change the physical characteristics of their surfaces, or to change their shape, e.g. etching, polishing, cutting
304
Mechanical treatment, e.g. grinding, polishing, cutting
Applicants:
リンテック株式会社 LINTEC CORPORATION [JP/JP]; 東京都板橋区本町23番23号 23-23, Honcho, Itabashi-ku, Tokyo 1730001, JP
Inventors:
富永 知親 TOMINAGA, Tomochika; JP
堀米 克彦 HORIGOME, Katsuhiko; JP
Agent:
大谷 保 OHTANI, Tamotsu; JP
片岡 誠 KATAOKA, Makoto; JP
Priority Data:
2016-04126103.03.2016JP
Title (EN) ADHESIVE TAPE FOR SEMICONDUCTOR PROCESSING AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
(FR) RUBAN ADHÉSIF POUR USINAGE DE SEMI-CONDUCTEUR, ET PROCÉDÉ DE FABRICATION DE DISPOSITIF À SEMI-CONDUCTEURS
(JA) 半導体加工用粘着テープ、及び半導体装置の製造方法
Abstract:
(EN) This adhesive tape for semiconductor processing is used by attaching said adhesive tape to the surface of a semiconductor wafer in a step in which the rear surface of a semiconductor wafer having a groove or a modified area formed on the semiconductor wafer surface thereof is ground and the semiconductor wafer is separated into individual semiconductor chips by the grinding. The adhesive tape for semiconductor processing is provided with a substrate, a buffer layer provided on one surface of the substrate, and an adhesive layer provided on the other surface of the substrate. The overall tape thickness of the adhesive tape for semiconductor processing is 160 µm or less, the ratio (D2/D1) of the thickness (D2) of the buffer layer with respect to the thickness (D1) of the substrate is 0.7 or less, and the peel strength with respect to a semiconductor wafer is 1000 mN/50 mm or less.
(FR) Le ruban adhésif pour usinage de semi-conducteur de l’invention est mis en œuvre par collage à la surface d’une tranche de semi-conducteur, lors d’une étape au cours de laquelle une rainure est formée dans la surface de la tranche de semi-conducteur, ou la face arrière de la tranche de semi-conducteur dans laquelle est formée une région modifiée est meulée, et la tranche de semi-conducteur est découpée en puces semi-conductrices par meulage. Ce ruban adhésif pour usinage de semi-conducteur est équipé d’un matériau de base, d’une couche d’amortissement agencée sur une des faces dudit matériau de base, et d’une couche d’adhésif agencée sur l’autre face dudit matériau de base. Le ruban adhésif pour usinage de semi-conducteur présente une épaisseur totale inférieure ou égale à 160μm, un rapport (D2/D1) de l’épaisseur (D2) de ladite couche d’amortissement par rapport à l’épaisseur (D1) du matériau de base, inférieur ou égal à 0,7, et une force de pelage vis-à-vis de la tranche de semi-conducteur inférieure ou égale à 1000mN/50mm.
(JA) 本発明の半導体加工用粘着テープは、半導体ウエハ表面に溝が形成され、又は改質領域が形成された半導体ウエハの裏面を研削して、その研削により半導体ウエハを半導体チップに個片化する工程において、半導体ウエハの表面に貼付されて使用される半導体加工用粘着テープであって、基材と、前記基材の一方の面に設けられる緩衝層と、前記基材の他方の面に設けられる粘着剤層とを備え、半導体加工用粘着テープのテープ総厚が160μm以下であり、かつ前記緩衝層の厚さ(D2)の基材の厚さ(D1)に対する比(D2/D1)が0.7以下であるとともに、半導体ウエハに対する剥離力が1000mN/50mm以下である。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)