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1. (WO2017150675) ADHESIVE TAPE FOR SEMICONDUCTOR PROCESSING AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE

Pub. No.:    WO/2017/150675    International Application No.:    PCT/JP2017/008313
Publication Date: Sat Sep 09 01:59:59 CEST 2017 International Filing Date: Fri Mar 03 00:59:59 CET 2017
IPC: H01L 21/301
B23K 26/53
C09J 7/02
C09J 201/00
Applicants: LINTEC CORPORATION
リンテック株式会社
Inventors: TOMINAGA, Tomochika
富永 知親
HORIGOME, Katsuhiko
堀米 克彦
Title: ADHESIVE TAPE FOR SEMICONDUCTOR PROCESSING AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
Abstract:
This adhesive tape for semiconductor processing is used by attaching said adhesive tape to the surface of a semiconductor wafer in a step in which the rear surface of a semiconductor wafer having a groove or a modified area formed on the semiconductor wafer surface thereof is ground and the semiconductor wafer is separated into individual semiconductor chips by the grinding. The adhesive tape for semiconductor processing is provided with a substrate, a buffer layer provided on one surface of the substrate, and an adhesive layer provided on the other surface side of the buffer layer. The ratio (D2/D1) of the thickness (D2) of the buffer layer with respect to the thickness (D1) of the substrate is 0.7 or less and the indentation depth (X) of the buffer layer-side surface is 2.5 µm or less.