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1. (WO2017150657) PLATING APPARATUS AND PLATING METHOD

Pub. No.:    WO/2017/150657    International Application No.:    PCT/JP2017/008256
Publication Date: Sat Sep 09 01:59:59 CEST 2017 International Filing Date: Fri Mar 03 00:59:59 CET 2017
IPC: C25D 17/00
C23G 1/02
C25D 5/34
C25D 7/12
C25D 17/06
H01L 21/288
Applicants: EBARA CORPORATION
株式会社荏原製作所
Inventors: NAGAI, Mizuki
長井 瑞樹
SHIMOYAMA, Masashi
下山 正
KISHI, Takashi
岸 貴士
NISHIURA, Fumitoshi
西浦 文敏
Title: PLATING APPARATUS AND PLATING METHOD
Abstract:
The present invention prevents degradation of uniformity of the thickness of a plating film due to organic material adhering to an edge section of a substrate and/or an oxide film formed on the edge section of the substrate. A plating apparatus for plating a substrate is provided. This plating apparatus has a plating bath for applying a voltage to a substrate set in a substrate holder and plating the substrate, and an edge section washing device for locally removing an organic material and/or an oxide film present on an edge section of the substrate before the substrate is set in the substrate holder.