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|1. (WO2017150657) PLATING APPARATUS AND PLATING METHOD|
|Title:||PLATING APPARATUS AND PLATING METHOD|
The present invention prevents degradation of uniformity of the thickness of a plating film due to organic material adhering to an edge section of a substrate and/or an oxide film formed on the edge section of the substrate. A plating apparatus for plating a substrate is provided. This plating apparatus has a plating bath for applying a voltage to a substrate set in a substrate holder and plating the substrate, and an edge section washing device for locally removing an organic material and/or an oxide film present on an edge section of the substrate before the substrate is set in the substrate holder.