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1. (WO2017150614) ELECTRONIC COMPONENT MODULE, DC-DC CONVERTER, AND ELECTRONIC DEVICE
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Pub. No.: WO/2017/150614 International Application No.: PCT/JP2017/008117
Publication Date: 08.09.2017 International Filing Date: 01.03.2017
IPC:
H05K 1/16 (2006.01) ,H02M 3/155 (2006.01) ,H05K 1/02 (2006.01)
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1
Printed circuits
16
incorporating printed electric components, e.g. printed resistor, capacitor, inductor
H ELECTRICITY
02
GENERATION, CONVERSION, OR DISTRIBUTION OF ELECTRIC POWER
M
APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
3
Conversion of dc power input into dc power output
02
without intermediate conversion into ac
04
by static converters
10
using discharge tubes with control electrode or semiconductor devices with control electrode
145
using devices of a triode or transistor type requiring continuous application of a control signal
155
using semiconductor devices only
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1
Printed circuits
02
Details
Applicants:
株式会社村田製作所 MURATA MANUFACTURING CO., LTD. [JP/JP]; 京都府長岡京市東神足1丁目10番1号 10-1, Higashikotari 1-chome, Nagaokakyo-shi, Kyoto 6178555, JP
Inventors:
米森 啓人 YONEMORI, Keito; JP
Agent:
吉川 修一 YOSHIKAWA, Shuichi; JP
傍島 正朗 SOBAJIMA, Masaaki; JP
Priority Data:
2016-04035402.03.2016JP
Title (EN) ELECTRONIC COMPONENT MODULE, DC-DC CONVERTER, AND ELECTRONIC DEVICE
(FR) MODULE DE COMPOSANT ÉLECTRONIQUE, CONVERTISSEUR CC-CC ET DISPOSITIF ÉLECTRONIQUE
(JA) 電子部品モジュール、DC-DCコンバータおよび電子機器
Abstract:
(EN) This electronic component module (1) is provided with a substrate (10), a coil element (12) provided in the substrate (10), and an IC element (20) connected to the coil element (12). A plurality of external terminals (14) are provided to the substrate (10). When the substrate (10) is viewed in a plan view, the substrate (10) has a first area (R), and a second area (F) which is different to the first area (R). The IC element (20) is provided in the first area (R). The plurality of external terminals (14) are provided in at least the first area (R). The coil element (12) is formed extending across the first area (R) and the second area (F). The first area (R) is rigid. The second area (F) is more flexible than the first area (R).
(FR) La présente invention concerne un module de composant électronique (1) qui comporte un substrat (10), un élément de bobine (12) disposé dans le substrat (10) et un élément de circuit intégré (20) raccordé à l'élément de bobine (12). Une pluralité de bornes externes (14) sont disposées sur le substrat (10). Lorsque le substrat (10) est observé selon une vue en plan, le substrat (10) présente une première zone (R) et une seconde zone (F) qui est différente de la première zone (R). L'élément de circuit intégré (20) est disposé dans la première zone (R). La pluralité de bornes externes (14) sont disposées dans au moins la première zone (R). L'élément de bobine (12) est formé de sorte à s'étendre à travers la première zone (R) et la seconde zone (F). La première zone (R) est rigide. La seconde zone (F) est plus flexible que la première zone (R).
(JA) 基板(10)と、基板(10)に設けられたコイル素子(12)と、コイル素子(12)に接続されたIC素子(20)とを備える電子部品モジュール(1)であって、基板(10)には、複数の外部端子(14)が設けられ、基板(10)を平面視した場合に、基板(10)は、第1領域(R)と、第1領域(R)とは異なる領域である第2領域(F)とを有し、IC素子(20)は、第1領域(R)に設けられ、複数の外部端子(14)は、少なくとも第1領域(R)に設けられ、コイル素子(12)は、第1領域(R)と第2領域(F)とを跨って形成され、第1領域(R)はリジッドな領域であり、第2領域(F)は第1領域(R)よりもフレキシブルな領域である。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)