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1. (WO2017150611) MODULE COMPONENT, METHOD FOR PRODUCING MODULE COMPONENT, AND MULTILAYER SUBSTRATE

Pub. No.:    WO/2017/150611    International Application No.:    PCT/JP2017/008111
Publication Date: Sat Sep 09 01:59:59 CEST 2017 International Filing Date: Thu Mar 02 00:59:59 CET 2017
IPC: H01F 27/06
H01F 17/00
H01F 41/04
H01L 23/12
H01L 25/00
H02M 3/155
H05K 1/16
H05K 3/46
Applicants: MURATA MANUFACTURING CO., LTD.
株式会社村田製作所
Inventors: IIJIMA, Koichiro
飯島 光一郎
Title: MODULE COMPONENT, METHOD FOR PRODUCING MODULE COMPONENT, AND MULTILAYER SUBSTRATE
Abstract:
This module component (1) is provided with: a ceramic multiplayer substrate (11) which has a coil (31) incorporated therein and which has a first terminal electrode (142) and a second terminal electrode (143) that are connected to one main surface and the other main surface of the coil (31), respectively; a first thermoplastic resin layer (12) which is disposed on one main surface of the ceramic multilayer substrate (11) and which has first wires (151, 152) that are connected to the first terminal electrode (142), and which has a first land (153) for mounting a surface-mounted component thereon; a second thermoplastic layer (13) which is disposed on the other main surface of the ceramic multilayer substrate (11), which has a second wire (161) that is connected to the second terminal electrode (143), and which has a second land (162) serving as a connection terminal to a mother board; and a switching IC chip (32) and a chip capacitor (33) that are mounted on the first thermoplastic resin layer (12) and are connected to the first land (153) of the first thermoplastic resin layer (12).