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1. (WO2017150588) COMPOSITION FOR HEAT-DISSIPATING MEMBER, HEAT-DISSIPATING MEMBER, ELECTRONIC INSTRUMENT, METHOD FOR PRODUCING COMPOSITION FOR HEAT-DISSIPATING MEMBER, AND METHOD FOR PRODUCING HEAT-DISSIPATING MEMBER

Pub. No.:    WO/2017/150588    International Application No.:    PCT/JP2017/008028
Publication Date: Sat Sep 09 01:59:59 CEST 2017 International Filing Date: Wed Mar 01 00:59:59 CET 2017
IPC: C09K 5/14
C08G 59/40
C08G 79/00
Applicants: JNC CORPORATION
JNC株式会社
OSAKA RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE AND TECHNOLOGY
地方独立行政法人大阪産業技術研究所
Inventors: FUJIWARA, Takeshi
藤原 武
INAGAKI, Jyunichi
稲垣 順一
HINATSU, Masako
日夏 雅子
AGARI, Yasuyuki
上利 泰幸
HIRANO, Hiroshi
平野 寛
KADOTA, Joji
門多 丈治
OKADA, Akinori
岡田 哲周
Title: COMPOSITION FOR HEAT-DISSIPATING MEMBER, HEAT-DISSIPATING MEMBER, ELECTRONIC INSTRUMENT, METHOD FOR PRODUCING COMPOSITION FOR HEAT-DISSIPATING MEMBER, AND METHOD FOR PRODUCING HEAT-DISSIPATING MEMBER
Abstract:
The inventions are: a composition capable of forming a heat-dissipating member that has high thermal conductivity and in which the thermal expansion coefficient can be controlled; and a heat-dissipating member. This composition for a heat-dissipating member comprises a thermally conductive first inorganic filler bonded to one end of a first coupling agent, and a thermally conductive second inorganic filler bonded to one end of a second coupling agent, the composition being characterized in that: at least one of the first coupling agent and the second coupling agent is a liquid crystal silane coupling agent; the other end of the first coupling agent and the other end of the second coupling agent each have a functional group bondable with one another; and the other end of the first coupling agent bonds with the other end of the second coupling agent by a curing treatment.