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1. (WO2017150587) COMPOSITION FOR LOW THERMAL EXPANSION MEMBERS, LOW THERMAL EXPANSION MEMBER, ELECTRONIC DEVICE, AND METHOD FOR PRODUCING LOW THERMAL EXPANSION MEMBER

Pub. No.:    WO/2017/150587    International Application No.:    PCT/JP2017/008027
Publication Date: Sat Sep 09 01:59:59 CEST 2017 International Filing Date: Wed Mar 01 00:59:59 CET 2017
IPC: C08L 59/00
C08K 3/00
C08K 7/14
C09K 5/14
Applicants: JNC CORPORATION
JNC株式会社
OSAKA RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE AND TECHNOLOGY
地方独立行政法人大阪産業技術研究所
Inventors: FUJIWARA,Takeshi
藤原 武
INAGAKI, Jyunichi
稲垣 順一
AGARI, Yasuyuki
上利 泰幸
HIRANO, Hiroshi
平野 寛
KADOTA, Joji
門多 丈治
OKADA, Akinori
岡田 哲周
Title: COMPOSITION FOR LOW THERMAL EXPANSION MEMBERS, LOW THERMAL EXPANSION MEMBER, ELECTRONIC DEVICE, AND METHOD FOR PRODUCING LOW THERMAL EXPANSION MEMBER
Abstract:
The present invention provides: a composition for low thermal expansion members, which is capable of forming a low thermal expansion member that has a thermal expansion coefficient close to those of the members within a semiconductor element, while having high heat resistance and high heat conductivity; and a low thermal expansion member. A composition for low thermal expansion members according to the present invention is characterized by containing: a heat conductive first inorganic filler 1 that is bonded to one end of a first coupling agent 11; and a heat conductive second inorganic filler 2 that is bonded to one end of a second coupling agent 12. This composition for low thermal expansion members is also characterized in that the first inorganic filler 1 and the second inorganic filler 2 are bonded to each other via the first coupling agent 11 and the second coupling agent 12 by means of a curing treatment.