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1. (WO2017150361) RESIN SUBSTRATE

Pub. No.:    WO/2017/150361    International Application No.:    PCT/JP2017/007010
Publication Date: Sat Sep 09 01:59:59 CEST 2017 International Filing Date: Sat Feb 25 00:59:59 CET 2017
IPC: H05K 3/46
Applicants: MURATA MANUFACTURING CO., LTD.
株式会社村田製作所
Inventors: ADACHI Toshiro
足立 登志郎
Title: RESIN SUBSTRATE
Abstract:
Provided is a resin substrate (10) comprising: a first portion (P01) constituted by resin sheets (101, 102, 103) at one end side in a lamination direction; and a second portion (P02) constituted by resin sheets (104, 105, 106) at the other end side in the lamination direction. The thickness of the plurality of resin sheets (101-106) is approximately the same in the first portion (P01) and the second portion (P02). The density of a planar conductor pattern (210) of the first portion (P01) relative to the volume of the first portion (P01) is less than the density of a planar conductor pattern (220) of the second portion (P02) relative to the volume of the second portion (P02). The average diameter φ10 of an interlayer connection conductor (310) formed in the first portion (P01) is greater than the average diameter φ20 of an interlayer connection conductor (320) formed in the second portion (P02).