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1. (WO2017150343) SEMICONDUCTOR DEVICE

Pub. No.:    WO/2017/150343    International Application No.:    PCT/JP2017/006898
Publication Date: Sat Sep 09 01:59:59 CEST 2017 International Filing Date: Fri Feb 24 00:59:59 CET 2017
IPC: H01L 21/3205
G01L 9/00
H01L 21/768
H01L 23/522
H01L 29/84
Applicants: DENSO CORPORATION
株式会社デンソー
Inventors: KAKUTA Kazuyuki
角田 和之
YOKURA Hisanori
与倉 久則
MURATA Minoru
村田 稔
Title: SEMICONDUCTOR DEVICE
Abstract:
This semiconductor device is provided with: a first substrate (10) wherein a plurality of connection parts (19-21) are formed on a surface (10a) side; a second substrate (30) that is bonded with the first substrate (10) and is provided with a plurality of through holes (36) through which the plurality of connection parts (19-21) are respectively exposed, said through holes (36) being formed in the lamination direction on the first substrate (10); a plurality of through electrodes (38) that are respectively arranged in the plurality of through holes (36) and are electrically connected to the plurality of connection parts (19-21), respectively; and a protective film (41) that integrally covers the plurality of through electrodes (38). In addition, the protective film (41) is provided with a plurality of frame-like slits (41d) that respectively surround the openings of the plurality of through holes (36) when viewed from the normal direction with respect to the surface (10a) of the first substrate (10), so that regions positioned inside the slits (41) and regions positioned outside the slits (41) are separated from each other by means of the slits (41).