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1. (WO2017150284) COPPER FOIL WITH CARRIER, CORELESS SUPPORT WITH WIRING LAYER, AND METHOD FOR PRODUCING PRINTED CIRCUIT BOARD

Pub. No.:    WO/2017/150284    International Application No.:    PCT/JP2017/006423
Publication Date: Sat Sep 09 01:59:59 CEST 2017 International Filing Date: Wed Feb 22 00:59:59 CET 2017
IPC: C23C 14/06
B32B 7/06
B32B 15/04
C23C 14/14
C23C 28/00
H01L 23/12
H05K 1/09
H05K 3/46
Applicants: MITSUI MINING & SMELTING CO., LTD.
三井金属鉱業株式会社
Inventors: MATSUURA Yoshinori
松浦 宜範
Title: COPPER FOIL WITH CARRIER, CORELESS SUPPORT WITH WIRING LAYER, AND METHOD FOR PRODUCING PRINTED CIRCUIT BOARD
Abstract:
Provided is a copper foil with a carrier, which exhibits excellent peeling resistance to a developing solution during a photoresist development step and which is capable of demonstrating excellent stability with respect to the mechanical peeling strength of a carrier. This copper foil with a carrier comprises: a carrier; an intermediate layer disposed on the carrier where the surface on the carrier side contains at least 1.0 at% of at least one metal selected from the group consisting of Ti, Cr, Mo, Mn, W and Ni and the surface on the side opposite the carrier contains at least 30 at% of Cu; a peelable layer disposed on the intermediate layer; and an ultrathin copper layer disposed on the peelable layer.