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|1. (WO2017150284) COPPER FOIL WITH CARRIER, CORELESS SUPPORT WITH WIRING LAYER, AND METHOD FOR PRODUCING PRINTED CIRCUIT BOARD|
|Applicants:||MITSUI MINING & SMELTING CO., LTD.
|Title:||COPPER FOIL WITH CARRIER, CORELESS SUPPORT WITH WIRING LAYER, AND METHOD FOR PRODUCING PRINTED CIRCUIT BOARD|
Provided is a copper foil with a carrier, which exhibits excellent peeling resistance to a developing solution during a photoresist development step and which is capable of demonstrating excellent stability with respect to the mechanical peeling strength of a carrier. This copper foil with a carrier comprises: a carrier; an intermediate layer disposed on the carrier where the surface on the carrier side contains at least 1.0 at% of at least one metal selected from the group consisting of Ti, Cr, Mo, Mn, W and Ni and the surface on the side opposite the carrier contains at least 30 at% of Cu; a peelable layer disposed on the intermediate layer; and an ultrathin copper layer disposed on the peelable layer.