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1. (WO2017150231) RESIN SHEET

Pub. No.:    WO/2017/150231    International Application No.:    PCT/JP2017/006047
Publication Date: Sat Sep 09 01:59:59 CEST 2017 International Filing Date: Tue Feb 21 00:59:59 CET 2017
IPC: H05K 3/28
C08K 3/36
C08L 63/00
C08L 79/00
C08L 101/00
Applicants: SUMITOMO BAKELITE CO., LTD.
住友ベークライト株式会社
Inventors: TAKAHASHI Akihito
高橋 昭仁
Title: RESIN SHEET
Abstract:
This resin sheet is used for a solder resist, and is provided with: a carrier base; and a resin layer that is arranged on the carrier base and is formed from a resin composition for solder resists. The resin layer has a film thickness of from 1 μm to 50 μm (inclusive); and if η is the minimum value of the complex dynamic viscosity as determined by a dynamic viscoelasticity test of the resin layer in a B-stage state, said test being carried out in a measurement range of 50-200°C at a heating rate of 3°C/min at a frequency of 62.83 rad/sec, η is from 100 Pa·s to 3,000 Pa·s (inclusive). A cured product of the resin layer has a storage elastic modulus of from 7 GPa to 40 GPa (inclusive) at 30°C.